Empower to show vertical power architecture for AI and HPC

Empower Semiconductor is to show its Crescendo vertical power platform win Europe for the first time next week.

The Empower Crescendo with FinFast technology provides scalable true vertical power for artificial intelligence (AI) and high-performance computing (HPC) up to 3000A.

The Crescendo platform, lanunched las month,  integrates all power components in a single device thin enough to relocate underneath the processor and supply on-demand kilowatt power with unmatched speed and accuracy. It eliminates virtually all capacitor banks, shrinking board space by 5x and reducing system power losses by up to 20%.

This is designed to address the pressing power delivery challenges of AI processors and uses Empower’s FinFast technology to offer a unique integration of advanced silicon processes, magnetics and silicon capacitors with a proprietary control architectures in a thermally-efficient power package. The technology will be shown for the first time in the region at the electronica exhibition in Munich next week.

“Bringing Crescendo to electronica is an important and proud milestone for Empower,” stated Eric Pittana, senior director of global marketing and EMEA sales for Empower Semiconductor. “Following the strong reception we received during the unveil in the U.S. market in October, we’re eager to demonstrate to our European customers how Crescendo is the answer to their kilowatt-range power delivery problem.”