Infineon expands XENSIV MEMS microphone range

Infineon has recently expanded its XENSIV MEMS microphone portfolio by introducing two new digital PDM devices, the IM72D128V and the IM69D129F. These innovative devices are designed to enhance signal quality while simultaneously reducing power consumption. The primary target markets for these new XENSIV MEMS microphones are consumer electronics, IoT devices, and automotive audio systems, where durability and extended battery life are crucial factors.

When considering the needs of eeNews Europe readers, the key features of the IM72D128V and IM69D129F become apparent. With high SNR, IP57 protection through Sealed Dual Membrane (SDM) technology, and operating currents below 0.5 mA, these devices are ideal for next-generation earbuds, ANC headsets, laptops, tablets, and embedded multi-microphone arrays. They are also well-suited for applications such as voice user interfaces and in-cabin infotainment systems, where consistent performance and precise calibration are essential.

Exploring the Features of the XENSIV Parts

The IM72D128V is optimized for premium audio capture, offering a 71.5 dB(A) SNR for superior noise reduction. It operates at just 430 µA in high-performance mode and 160 µA in low-power mode, striking a balance between power efficiency and performance. With a compact size of 4 × 3 × 1.2 mm³, this microphone is suitable for wearables and portable audio devices. On the other hand, the IM69D129F provides a 69 dB(A) SNR at 450 µA/170 µA (high/low modes) in a smaller 3.5 × 2.65 × 0.98 mm³ package, making it ideal for densely packed multi-microphone configurations. Both devices feature digital PDM technology, integrated low-noise preamps, and sigma-delta ADCs for seamless integration with common audio SoCs.

Infineon’s innovative SDM design not only provides IP57-rated protection against water and dust but also enables these microphones to operate reliably in challenging environments. With an 11 Hz flat frequency response and ±1 dB sensitivity tolerance, the IM72D128V and IM69D129F facilitate beamforming across microphone arrays. Moreover, these devices comply with industry standards such as IEC 60747/60749 and JEDEC 47/20/22, ensuring high reliability and performance consistency.

Significance of the XENSIV MEMS Microphone Update

For embedded system designers, the latest XENSIV MEMS microphone offerings present a practical solution for achieving higher SNR levels at lower power consumption. By maintaining PDM signaling and precise sensitivity binning while enhancing environmental durability, these devices mitigate BOM risks and cater to the evolving demands of compact consumer electronics and automotive applications with multi-microphone arrays.