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Micron breaks ground on US$7 billion Singapore HBM packaging facility
January 09, 2025
Micron Technology Inc. (Boise, Idaho) has broken ground on a high-bandwidth memory (HBM) packaging facility in Singapore adjacent to the company’s wafer fab there.
The facility has a budget of US$7 billion to be spent over several years and is intended to help meet demand for AI logic. The factory is scheduled to start operations in 2026 with meaningful expansion of Micron’s advanced packaging capacity arriving in 2027, the company said.
The US$7 billion is expected to be spent over the period to beyond the end of the decade. It will initially create about 1,400 jobs with subsequent expansions expected to take the head count to 3,000, Micron said. The jobs will cover packaging development, assembly and test operations.
“This is Singapore’s first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth,” said Png Cheong Boon, chairman of the Singapore Economic Development Board, in statement issued by Micron.
Micron said that its Singapore plans include long-term support for NAND flash manufacturing.
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