New Large FCBGA Substrate Optimized for Data Centers

FCBGA, short for Flip-Chip Ball Grid Array, is a high-density semiconductor substrate that plays a crucial role in connecting semiconductor chips and package substrates. This innovative technology not only enhances electrical connectivity but also improves thermal characteristics, making it a preferred choice for various applications.

The large body FCBGA substrate represents the pinnacle of state-of-the-art engineering, boasting dimensions of 100 x 100 mm and featuring 20 or more layers. Primarily utilized in high-performance computing (HPC) chips, commonly found in data centers, this substrate is also compatible with CPUs, GPUs, and advanced 2.5D packages like CoWoS (Chip on Wafer on Substrate) used in AI servers.

Looking towards the future, the company behind this groundbreaking technology is gearing up for the next wave of innovation in the packaging market. By integrating silicon capacitor embedding technology, bridge integration technology, and the large body FCBGA substrate technology, they are poised to set new benchmarks in the industry.

"As semiconductor technology continues to evolve at a rapid pace, our focus remains on expanding our presence in emerging markets such as AI and autonomous driving. Through strategic collaborations with global industry leaders, we aim to leverage our cutting-edge technology for mutual growth," stated Young-Joo KO, the Chief Technology Officer of Daeduck Electronics.

Founded in 1965, Daeduck Electronics has been at the forefront of Korea's electronics manufacturing landscape for over six decades. Renowned as a pioneer in PCB production, the company has played a pivotal role in advancing the nation's technological prowess. With operations across multiple locations in Korea and Vietnam, as well as a strong international presence in the US, China, and Taiwan, Daeduck Electronics is well-positioned for sustained growth in the global package substrate market.