New Packages Enhance Power Density with 650-V MOSFETs

Infineon Technologies is enhancing its range of CoolSiC™ MOSFET discretes 650 V with the introduction of two new product families, housed in the Thin-TOLL 8×8 and TOLT packages. These innovative offerings are designed to maximize the utilization of the PCB mainboard and daughter cards, while also considering the system's thermal requirements and space limitations. Leveraging the CoolSiC Generation 2 (G2) technology, these new products deliver improved figures-of-merit, reliability, and ease-of-use, catering specifically to high and medium switching-mode power supplies (SMPS) in various applications such as AI servers, renewable energy systems, EV chargers, and large home appliances.

The Thin-TOLL package, featuring a compact 8 x 8-mm form factor, boasts best-in-class Thermal Cycling on Board (TCoB) capability in the market. On the other hand, the TOLT package, a top-side cooled (TSC) enclosure with a form factor similar to TOLL, offers developers a range of advantages. For instance, when integrated into AI and server power supply units (PSU), these packages enable the reduction of daughter card dimensions, leading to a flatter heat sink. In applications like microinverters, 5G PSU, TV PSU, and SMPS, the Thin-TOLL 8×8 package helps minimize the PCB area occupied by power supply components on the mainboard, while the TOLT package effectively manages device junction temperature, especially in scenarios where convection cooling is utilized.

Moreover, the TOLT devices complement Infineon's existing top-side cooled CoolSiC industrial portfolio, which includes CoolSiC 750 V in Q-DPAK. By leveraging these packages, developers can optimize the PCB footprint occupied by SiC MOSFETs, particularly in situations where the power requirements do not necessitate a Q-DPAK package. The expansion of the CoolSiC MOSFETs 650 V G2 in ThinTOLL 8×8 and TOLT packages now offers RDS(on) options ranging from 20, 40, 50, and 60 mΩ, with the TOLT variant also available with an RDS(on) of 15 mΩ. Infineon plans to further enhance this product family with a more extensive portfolio by the end of 2024.

For more information on the latest CoolSiC™ MOSFET discretes 650 V product offerings from Infineon Technologies, visit www.infineon.com/coolsic-gen2.