Electronic Breaking News

Eve taps Infineon for BMS chips

Eve taps Infineon for BMS chips

Eve Energy has signed a deal to use battery management systems (BMS) chips from Infineon Technologies.The memorandum of understanding (MoU) covers a complete chipset, including microcontroller units, balancing and monitoring ICs, power management ICs, drivers, MOSFETs, controller area networks and sensor products.These...

Published on: December 13, 2024

Optical interconnect startup reaches $1bn unicorn status

Optical interconnect startup reaches $1bn unicorn status

US startup Ayar Labs has raised $155m to scale its optical interconnect technology with a valuation of over $1bn.The funding for Ayar Labs, which also has a UK design centre, brings the total raised to $370m and comes from AMD, Intel and...

Published on: December 13, 2024

Tenstorrent powers first automotive RISC-V AI accelerator chiplet

Tenstorrent powers first automotive RISC-V AI accelerator chiplet

BOS Semiconductors in Korea has developed the industry’s first RISC-V AI accelerator chiplet using IP from US startup Tenstorrent.The Eagle-N chiplet was jointly developed by the two companies with the Tenstorrent Tensix NPU core, which is tailored for automotive applications such as...

Published on: December 12, 2024

First Ultra Ethernet, UALink IP

First Ultra Ethernet, UALink IP

Synopsys has launched the industry’s first Ultra Ethernet IP and UALink IP for standards-based, high-bandwidth, and low-latency HPC and AI accelerator interconnect.The IP includes controllers, PHYs, and verification IP for chips that have to handle trillions of parameters in the next generation of AI models.The...

Published on: December 12, 2024

Power management reference designs for digital cockpits

Power management reference designs for digital cockpits

Rohm has developed reference designs for digital cockpits using chip from Telechips and its power management ICs.  The digital cockpit reference cockpit designs use the Dolphin3 and Dolphin5 from Telechips in Korea with the designs scheduled for mass production in 2025.Rohm and Telechips...

Published on: December 12, 2024

Cubic Telecom and Skylo bring satellite capabilities to vehicles

Cubic Telecom and Skylo bring satellite capabilities to vehicles

Cubic Telecom, a connected vehicle provider, and Skylo Technologies have unveiled a commercial partnership that will provide Cubic with access to Skylo’s global network. Further, Non-terrestrial network (NTN) communications enabled by Skylo will be offered as a network connectivity option with seamless...

Published on: December 12, 2024

Guerrilla RF growth driven by direct-to-cellular satellite

Guerrilla RF growth driven by direct-to-cellular satellite

Guerrilla RF has announced a 125% year-over-year growth in its satellite communication (Satcom) business, which has been largely driven by the increasing demand for its products in direct-to-cellular satellite applications.The GSMA, which represents 800 mobile operators and over 300 companies in the...

Published on: December 12, 2024

First AI-powered hyper-definition radar OS for ADAS

First AI-powered hyper-definition radar OS for ADAS

Neural Propulsion Systems (NPS) has announced the availability of its Hyper-Definition Radar Operating System (HROS™) for advanced driver assistance system (ADAS) providers.This hyper-definition, AI-powered software-defined radar system is becoming essential for automakers to differentiate offerings and meet increasing consumer expectations for safety,...

Published on: December 12, 2024

Altermagnetism can create new memory devices

Altermagnetism can create new memory devices

A new class of magnetism called altermagnetism has been imaged for the first time in a new study. The findings could lead to the development of new magnetic memory devices with the potential to increase operation speeds of up to a thousand...

Published on: December 12, 2024

imec taps CCD for 3D CXL memory in data centres

imec taps CCD for 3D CXL memory in data centres

Belgian research lab imec has developed a 3D charge-coupled device that could be used as a replacement for DRAM in data-intensive compute applications.The compute express link (CXL) type-3 buffer memory promises to vastly surpass DRAM in terms of bit density and cost...

Published on: December 12, 2024