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Wolfspeed launches fourth generation SiC technology

Wolfspeed launches fourth generation SiC technology

Wolfspeed has launched its fourth generation silicon carbide (SiC) technology platform for power applications.The first two bare die in the 1200V CPM4 family for industrial applications have on resistance of 26mΩ with 90A and 42mΩ with 55mA. This is 20% lower at...

Published on: January 22, 2025

Copper-Diamond composite for AI chip cooling

Copper-Diamond composite for AI chip cooling

UK-based Element Six (E6) has developed a copper-diamond composite material that has a high thermal and electrical conductivity for cooling AI chips and GaN RF devices.The Cu-Diamond composite consists of diamond grit in a regular array in copper and has a thermal...

Published on: January 22, 2025

Audio DAC IC with high-definition monaural mode

Audio DAC IC with high-definition monaural mode

ROHM has developed the 32-bit D/A converter (DAC) chip as well as an evaluation board designed for flagship devices in the MUS-IC™ series optimized for high-resolution audio playback.The latest product builds on the first generation BD34301EKV MUS-IC™ audio DAC chip, renowned for...

Published on: January 22, 2025

SiC MOSFET platform drives efficiency, cuts system costs

SiC MOSFET platform drives efficiency, cuts system costs

Wolfspeed has introduced its new Gen 4 SiC technology platform, which introduces holistic efficiency improvements to enable reduced system costs and development time while maximizing application lifetime.Engineered to simplify switching behaviors and design challenges commonly experienced in high-power designs, the Gen 4...

Published on: January 22, 2025

1700V SiC MOSFETs, bare die, modules

1700V SiC MOSFETs, bare die, modules

SemiQ has launched a series of 1700 V silicon carbide (SiC) MOSFETs for medium-voltage high power conversion applications.The 1700 V switching planar D-MOSFETs have a reliable body diode, capable of operation at up to 175oC, with all components tested to beyond 1900...

Published on: January 22, 2025

First 1250V MLCC with 10 nF in 3225 format

First 1250V MLCC with 10 nF in 3225 format

TDK has launched the industry’s highest capacity multilayer ceramic capacitors (MLCCs) at 1250V in a 3225 form factor.The 10nF CGA and C MLCC series measures 3.2 x 2.5 x 2.5 mm with C0G characteristics with a Class I dielectric.C0G characteristic products change...

Published on: January 22, 2025

End-to-end 5G Open RAN starter kit simplifies testing

End-to-end 5G Open RAN starter kit simplifies testing

A British wireless semiconductor innovator specialising in 5G Open RAN baseband technologies, RANsemi has launched its 5G Open RAN Starter Kit designed to enable out-of-the-box testing and accelerate the development of 5G radio access networks (RANs).The starter kit suits companies looking to...

Published on: January 22, 2025

Arm Cortex-M4 based MCUs target motor control applications

Arm Cortex-M4 based MCUs target motor control applications

Toshiba Electronics Europe GmbH has introduced seven new 32-bit microcontrollers (MCUs) with Arm® Cortex®-M4 cores, expanding its motor control lineup.The new MCUs are ideally suited for field-oriented control (FOC) of up to two AC motors, brushless DC (BLDC) motors and multiple types...

Published on: January 22, 2025

IAR supports TMC Arm Cortex-R52+ ASIL D MCUs

IAR supports TMC Arm Cortex-R52+ ASIL D MCUs

IAR has announced that IAR Embedded Workbench for Arm v9.60.3 supports the THA6 Gen2 series automotive-grade MCUs from Tongxin Microelectronics Co., Ltd., or TMC.The TMC THA6 Gen2 series is the first Arm Cortex-R52+ ASIL D MCU in China. Operating at a frequency...

Published on: January 22, 2025

Altium buys Part Analytics for AI supply chain capabilities

Altium buys Part Analytics for AI supply chain capabilities

Altium has completed the acquisition of Milwaukee-based Part Analytics for its leading AI-powered supply chain management platform, which enables manufacturers to quickly make fully informed decisions for large-scale component planning and procurement, particularly at the enterprise level.The acquisition will enable the introduction...

Published on: January 22, 2025

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