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Gasless DC power relays effective to 200-A, 500-VDC

Gasless DC power relays effective to 200-A, 500-VDC

Omron Electronic Components Europe has added two new variants to its extensive DC portfolio of power relays, designated the G9EK-1-UTU and G9EK-1-E.The power relays provide compact yet high-capacity gasless interruption for large currents and high voltages of 500 VDC or more. The...

Published on: January 15, 2025

MEMS-based ultrasonic transducer for industrial/medical use cases

MEMS-based ultrasonic transducer for industrial/medical use cases

Infineon Technologies AG has made advances in capacitive micromechanical ultrasonic transducer (CMUT) technology and is now manufacturing the first integrated one-chip MEMS-based ultrasonic transducer that offers a smaller footprint, improved performance, and higher functionality.Such integration makes the new device ideal for developing...

Published on: January 15, 2025

First single chip MEMS ultrasonic transducer

First single chip MEMS ultrasonic transducer

Infineon Technologies has developed what it says is the first single chip capacitive MEMS ultrasonic transducer for embedded switches and medical sensors.The size reduction of the capacitive micromechanical ultrasonic transducers (CMUT) opens up new ultrasonic applications in consumer electronics, the automotive industry,...

Published on: January 15, 2025

Full bridge controller for automotive brushed DC motors

Full bridge controller for automotive brushed DC motors

Infineon Technologies has launched a full bridge controller for brushed DC motors in automotive applications.The Motix Bridge BTM90xx family of full-bridge/ H-bridge controllers are optimised for applications such as door, mirror, seat, body and zone control modules. Accompanying safety documentation is available...

Published on: January 15, 2025

Current sensor ICs offer high isolation in a small footprint

Current sensor ICs offer high isolation in a small footprint

Allegro MicroSystems has launched two new current sensor ICs — the ACS37030MY and the ACS37220MZ.Leveraging cutting-edge sensing technology developed by Allegro, these current sensor ICs provide low internal conductor resistance, high operating bandwidth and reliable performance across a wide range of automotive,...

Published on: January 15, 2025

Cognizant, Siemens team on software-defined vehicle digital twins

Cognizant, Siemens team on software-defined vehicle digital twins

Cognizant in the US is to integrate the PAVE360 digital twin tool from Siemens Digital Industries Software into its software-defined vehicle (SDV) accelerator.The Congnizant tool uses the Siemens Simcenter Prescan for sensor modeling and scenario-based testing to build a digital twin for...

Published on: January 15, 2025

First Rust toolchain qualified for medical devices

First Rust toolchain qualified for medical devices

The Ferrocene Rust toolchain developed by Ferrous Systems in Germany is the first to be qualified to the IEC 62304 Class C standard for medical device software.Rust is rapidly gaining traction in the medical device industry due to its robust memory safety...

Published on: January 15, 2025

1.2kV IGBT module for industrial designs

1.2kV IGBT module for industrial designs

Mitsubishi Electric is to start sampling a 1200V IGBT power module for industrial applications.The LV100 will start sampling on 15th February for solar and other renewable-energy power-supply systems such as storage battery inverters. It uses an eighth-generation insulated gate bipolar transistor (IGBT)...

Published on: January 15, 2025

u-blox pulls out of cellular IoT

u-blox pulls out of cellular IoT

u-blox in Switzerland is pulling out of the cellular IoT business after failing to find a buyer.The company has lost CHF15m ($16.5m) in the first half of the year on revenue of CHF27m ($29.5m) on the business and will instead focus on...

Published on: January 15, 2025

Apple joins board of datacentre chip interconnect standard

Apple joins board of datacentre chip interconnect standard

Apple has been voted onto the board of the Ultra Accelerator Link (UALink) Consortium which is developing a standard for the interconnect for chips in datacentres.Apple joins with new board members Synopsys, which supplies UALink IP, and Chinese hyperscaler Alibaba Cloud Computing. Since...

Published on: January 15, 2025

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