Electronic Breaking News

Mahindra and Vector Informatik deliver on SDV collaboration

Mahindra and Vector Informatik deliver on SDV collaboration

In response to the increasing demands of Software-Defined Vehicles (SDV), Mahindra initiated a strategic partnership with Vector Informatik to strengthen its network architecture and prepare for future challenges.Guided by the dual challenge of creating a future-ready SDV architecture while incorporating transferable components,...

Published on: January 14, 2025

Project shows path to commercial quantum Internet

Project shows path to commercial quantum Internet

Researchers at the Oak Ridge National Laboratory (ORNL) in the US have shown the first transmission of an entangled quantum signal using multiple wavelength channels and automatic polarization stabilization over a commercial quantum network with no downtime.This opens up a practical quantum...

Published on: January 14, 2025

Edge hub supports popular AI chips

Edge hub supports popular AI chips

DeGirium in the US has developed a cloud-based hub that can be used as an evaluation platform to simplify AI prototyping and development at the edge. The hub enables developers to experiment with AI models for applications with accelerators and application processors from...

Published on: January 14, 2025

Mediatek, Denon join Audio Foundry in Wales

Mediatek, Denon join Audio Foundry in Wales

Taiwanese chip maker Mediatek has joined the Audio Foundry for automotive audio applications.Headquartered in Bridgend, Wales, UK, the Audio Foundry provides state-of-the-art makerspaces staffed by expert engineers, offering a platform for OEMs, component manufacturers, and technology providers for acoustic design and system...

Published on: January 14, 2025

Novel OLED stacks yield very bright microdisplays

Novel OLED stacks yield very bright microdisplays

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed novel OLED stacks that enable exceptionally bright microdisplays.The development lends itself to use in augmented reality (AR) glasses, which require especially bright displays in daylight to clearly recognize content. High brightness...

Published on: January 14, 2025

3D printed intricate antennas

3D printed intricate antennas

A new 3D printing/additive manufacturing platform that offers “unparalleled flexibility in antenna design and the capability for rapid printing of intricate antenna structures.”As reported in the latest issue of Nature Communications, the new platform—dubbed “charge programmed multi-material 3D printing” (CPD)—is a universal...

Published on: January 14, 2025

Collaboration offers OTA testing of next-generation WLAN devices

Collaboration offers OTA testing of next-generation WLAN devices

Extending their long-established collaboration, Bluetest and Rohde & Schwarz have integrated the Wi-Fi 7 test functionality of the CMX500 one-box signaling tester into the Bluetest Flow control software. Now, developers and manufacturers of next-generation WLAN technology can use the Bluetest reverberation test...

Published on: January 14, 2025

€20m for imec MRAM in-memory compute chiplet spinout

€20m for imec MRAM in-memory compute chiplet spinout

Vertical Compute has raised €20m to commercialise MRAM in-memory computing chiplet technology developed at imec in Belgium.The chiplet is expected to be based on spin MRAM technology developed at imec which can reduce power consumption by 80% and speed up the execution...

Published on: January 14, 2025

Work starts on VITA 100 embedded computing standard

Work starts on VITA 100 embedded computing standard

The VITA trade group has several working groups for the VITA 100 next generation high performance OpenVPX embedded computing standard.The VITA 100 working groups are currently defining a suite of standards as an evolution for OpenVPX, VPX and related mechanical standards.This aims...

Published on: January 14, 2025

Chinese cabin platform adds Qualcomm Snapdragon AI

Chinese cabin platform adds Qualcomm Snapdragon AI

Chinese tier one supplier Desay SV is using the Snapdragon Cockpit Elite chipset from Qualcomm Technologies for its latest AI-enabled cabin platform.The G10PH intelligent cabin platform will be powered by Qualcomm chipset with the Oryon CPU, Hexagon NPU for accelerated AI performance and...

Published on: January 13, 2025