The Semiconductor Industry Association (SIA) has criticised a US government plan to issue an export control ruling on AI chips that includes sweeping changes just days before the inauguration of President-elect Donald Trump.Nvidia Corp., the world’s leading vendor of AI processors and...
Published on: January 10, 2025
Siemens has launched a startup programme for early-stage engineering and manufacturing companies..The Siemens for Startups programme, announced at CES 2025 in Las Vegas this week, aims to help streamline development processes and scale faster by providing venture-related services and reduce the cost...
Published on: January 10, 2025
December sales at TSMC, the world’s leading foundry, exceeded expectations at NT$278.16 billion (about US$8.44 billion) sending AI stock prices higher.The sales were flat sequentially but 57.8 percent higher compared with December 2023. This took TSMC’s annual revenue for 2024 to NT$2,894.31...
Published on: January 10, 2025
Sebastian Fischer has taken over as chief executive of the Traco Power Group in Switzerland.Jennifer Caspar, company owner and Chair of the Board of Directors, together with her father Rolf Caspar and Ueli Wampfler, both members of the Board of Directors, will...
Published on: January 10, 2025
Rohm in Japan has developed a 1kW laser diode for LiDaR design in mobility applications.The RLD8BQAB3 is a surface mount infrared laser diode that measures 3.3 x 5.6mm and is 1.75mm high. Eight channels at 125W each provide 1kW of power for...
Published on: January 10, 2025
The University of Birmingham, working with Paragraf Ltd. (Somersham, England) has received two UK government awards to research graphene sensors at high and low temperatures.Graphene sensors could be used for the control of magnetic shielding and of qubit processors used in quantum...
Published on: January 10, 2025
Murata Manufacturing has shown a sample of the world’s smallest 006003 chip inductor measuring 0.16 mm x 0.08 mm.This is a 75% shrink in volume compared to the 008004 chip inductor at 0.25 mm × 0.125 mm, launched back in 2014. However...
Published on: January 10, 2025
Morse Micro has launched its highly anticipated second-generation MM8108 System-on-Chip (SoC), which builds on the success of the first-generation MM6108 SoC, while offering even better performance in all key areas of range, throughput, and power efficiency. It also reducing the cost, effort,...
Published on: January 10, 2025
HaiLa Technologies has introduced a new development platform to better support developers and researchers in creating extremely low power connected Wi-Fi.The HaiLa EVAL2000 development board features the HaiLa BSC2000 Passive Backscatter on Wi-Fi chip combined with ST Microelectronics’ ultra-low power MCU, the...
Published on: January 10, 2025
imec in Belgium has integrated GaAs laser diodes into silicon devices on 300mm wafers for the first time.Achieving room-temperature continuous-wave lasing with threshold currents as low as 5 mA and output powers exceeding 1 mW, the results demonstrate the potential of direct...
Published on: January 10, 2025