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The Netherlands introduces ChipNL Competence Centre

The Netherlands introduces ChipNL Competence Centre

The kick-off of the ChipNL Competence Centre this week marks an additional impulse to boost the innovation and capabilities of the Dutch semiconductor industryEstablished in alignment with the EU Chips Act, the Centre should advance technological capabilities and foster innovation in the...

Published on: December 23, 2024

A football field in a teaspoon: New material has insane surface area

A football field in a teaspoon: New material has insane surface area

Using principles from rocket science, researchers have created carbon with a record-breaking surface areaThe material can soak up about twice the amount of CO2 as current activated carbon materials and has impressive energy-storage capabilities. As you might remember from combining baking soda...

Published on: December 23, 2024

Tiny MEMS speaker-microphone for TWS devices

Tiny MEMS speaker-microphone for TWS devices

SonicEdge has launched SonicTwin, the first integrated MEMS speaker-microphone in a single package for True Wireless Stereo (TWS) earbuds and headphones.The tiny MEMS speaker-microphone measures just 8- x 4- x 1-mm and combines cutting-edge sound generation and sensing capabilities to set a...

Published on: December 23, 2024

3D UWB radar SoC offers 1.8 GHz programmable bandwidth

3D UWB radar SoC offers 1.8 GHz programmable bandwidth

ARIA Sensing has launched “Hydrogen,” a groundbreaking UWB radar SoC that sets a new industry benchmark as the first to offer 3D beamforming with programmable bandwidth up to 1.8 GHz. As a result, Hydrogen can use different center frequencies to operate worldwide...

Published on: December 23, 2024

Honda, Nissan detail merger plan, add Mitsubishi

Honda, Nissan detail merger plan, add Mitsubishi

Honda and Nissan have signed a memorandum of understanding (MOU) to start discussions on a joint holding company. A separate MoU explores a further merger with Mitsubishi.This follows an MOU back in March for a strategic partnership for the era of vehicle...

Published on: December 23, 2024

Collaboration brings extended test capabilities for GMSL-based devices

Collaboration brings extended test capabilities for GMSL-based devices

Rohde & Schwarz has collaborated with Analog Devices (ADI) to create a wide range of tests for gigabit multimedia serial link (GMSL) devices.The GMSL technology from ADI provides a cost-efficient, scalable, and simple SerDes solution designed to improve performance for high-speed video...

Published on: December 23, 2024

Agratas buys battery R&D centre in Oxford

Agratas buys battery R&D centre in Oxford

Battery maker Agratas has bought a new R&D facility in the UK to serve as its technology hub. The 22,857 sq ft (2,123 sq m) facility at Milton Park, Oxford, will serve as the company’s UK technology hub, further strengthening its global...

Published on: December 23, 2024

UCIe scales to 64 Gbit/s for 3nm chiplet interconnect

UCIe scales to 64 Gbit/s for 3nm chiplet interconnect

Alphawave Semi has shown the industry’s first 64 Gbit/s Die-to-Die (D2D) IP subsystem for the Universal Chiplet Interconnect Express (UCIe).The third generation IP, built on a 3nm process in both standard and advanced packaging at TSMC, follows the most recent Gen2 36...

Published on: December 23, 2024

Physicists magnetize a material with light

Physicists magnetize a material with light

The technique provides researchers with a powerful tool for controlling magnetism, and could help in designing faster, smaller, more energy-efficient memory chips – MIT news

Published on: December 22, 2024

US cuts funding for Amkor packaging plant, Samsung fab

US cuts funding for Amkor packaging plant, Samsung fab

The US government has confirmed nearly $5bn for Samsung fabs in Texas and $407m for Amkor in Arizona for packaging, both cut by 20% since the original announcements.The $407m funding for Amkor Technology Arizona, a subsidiary of Amkor Technology, will directly support...

Published on: December 22, 2024

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