Electronic Breaking News

Shape-Shifting Antenna Poised to Transform Communications

X-FAB launches SiC process platform for power MOSFET designs

X-FAB Silicon Foundries SE has launched XSICM03, its next-generation XbloX platform, advancing SiC process technology for power MOSFETs, delivering significantly reduced cell pitch, enabling increased die per wafer and improved on-state resistance without compromising reliability.XbloX is a streamlined business process and technology...

sureCore and Sarcina join forces on cryogenic packaging

Following the recent launch of a range of cryogenic IP after the successful evaluation of test chips in both 180 nm and 22nm process nodes, sureCore has teamed with packaging experts, Sarcina, who designed a custom package specifically for use at cryogenic...

Four EU projects target 6G power efficiency

Four major 6G projects are launching in January 2025 targeting power efficiency in next generation telecoms networks.The projects include energy harvesting to power AI sensors as well as trials of energy-efficient 6G network technologies.Funded through the Smart Networks and Services Joint Undertaking...

Nokia and Elisa deploy commercial 5G Cloud RAN in European first

Nokia has successfully completed a commercial Cloud RAN deployment with the Finnish telcomms and digital service provider, Elisa in Espoo, Finland.Elisa can now deploy Nokia’s commercial Cloud RAN, which can co-exist with purpose-built networks in hybrid environments and evolve into full cloud-native...

65V, 2A buck LED driver for longer lighting chains

Diodes has launched an automotive-compliant synchronous Buck LED driver with high-side current sense drives up to 2A from a wide 4.5V to 65V input voltage range.The AL8891Q supports up to 95% duty cycle, allowing the drive of longer LED chains such as daytime...

sureCore teams with Sarcina to package cryo silicon

sureCore in the UK has teamed up with US packaging expert Sarcina Technology to develop a custom package for cryogenic silicon chips.This follows the successful evaluation of test chips in both 180 nm and 22nm process nodes for memory IP in quantum...

Gaisler to build 7nm RISC-V chip for space

Frontgrade Gaisler in Sweden has signed a deal with the European Space Agency (ESA) to build a 7nm rad hard chip for space systems using the RISC-V architecture.The EEE Space Component Sovereignty for Europe programme will see Frontgrade Gaisler working with Belgian...

European chiplet pilot line starts operations

A pilot line for advanced packaging and heterogeneous integration, funded with €730 million by the European Union and multiple national funding authorities, has started operations.The line is known as APECs – for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems...

How the latest sensors analyse body fluids

A new generation of wearable sensors will fundamentally change medicine. Researchers at ETH Zurich and international experts have now published an overview showing what is possible with such sensors and what questions their developers should consider to ensure their successful future use