MIKROE has launched the compact add-on ML Vibro Sens Click board™, which is designed for precise motion and vibration sensing and analysis.Based on the FXLS8974CF, a 3-axis low-g accelerometer from NXP, this Click board™ offers high-performance and versatility ideal for developing and...
Published on: December 16, 2024
Bosch has signed a preliminary deal with the US government for $225m of direct funding and $350m of loans for its silicon carbide plant in Roseville, California.The preliminary memorandum of terms (PMT) under the CHIPS and Science Act will support the $1.9bn...
Published on: December 15, 2024
New framework advances experimental capabilities, including design and characterization, of microscale acoustic metamaterials – MITAcoustic metamaterials — architected materials that have tailored geometries designed to control the propagation of acoustic or elastic waves through a medium — have been studied extensively through...
Published on: December 15, 2024
IEDM is always eye opening for the advances of device technology. The 2024 meeting in San Francisco this week has not only shown the latest 2nm CMOS process technologies, but way beyond.TSMC is discussing the technology for its A16 node at the...
Published on: December 14, 2024
DNA-based storage company Biomemory SA (Paris, France) has raised US$18 million in a Series A round of funding led by Credit Mutuel Innovation.The round included the participation existing investor the French Tech Seed fund managed on behalf of the French state by...
Published on: December 13, 2024
Researchers in Lithuania have developed a nanolaser constructed from a series of silver nanocubes without the need for accurate alignment.Working with a partner n Japan, the researchers at the Kaunas University of Technology (KTU) developed the nanolaser with the silver nanocubes arranged...
Published on: December 13, 2024
MikroE has launched a Click board that helps the development and training of AI models for vibration analysis for machine health monitoring..The MikroE ML Vibro Sens Click uses the FXLS8974CF 3-axis low-g accelerometer from NXP Semiconductors which has ultra-low-power operation alongside high-performance...
Published on: December 13, 2024
Segger is Germany has announced support for the STM32N6, STMicroelectronics first microcontroller with a neural processing unit (NPU) for AI and machine learning designs.A wide range of Segger’s industry-leading tools, such as the J-Link and J-Trace debug and trace probes, Flasher in-system programmers, SystemView real-time analysis tool, embOS real-time...
Published on: December 13, 2024
Netrasemi Pvt Ltd. (Thiruvananthapuram, Kerala, India) has raised 100 million rupees (about US$1.2 million) in seed round of funding to build system chips aimed at edge AI.Netrasemi was founded in 2020 by Jyothis Indirabhai, Sreejith Varma and Deepa Geetha and the funding...
Published on: December 13, 2024
Marvell has said it has been working with the three leading memory chip makers – Micron, Samsung and SK Hynix – on a custom-HBM that improves the performance of its XPU AI accelerator.Marvell has said that working with – Micron, Samsung and...
Published on: December 13, 2024