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sureCore teams with Sarcina to package cryo silicon

sureCore teams with Sarcina to package cryo silicon

sureCore in the UK has teamed up with US packaging expert Sarcina Technology to develop a custom package for cryogenic silicon chips.This follows the successful evaluation of test chips in both 180 nm and 22nm process nodes for memory IP in quantum...

Published on: December 17, 2024

Gaisler to build 7nm RISC-V chip for space

Gaisler to build 7nm RISC-V chip for space

Frontgrade Gaisler in Sweden has signed a deal with the European Space Agency (ESA) to build a 7nm rad hard chip for space systems using the RISC-V architecture.The EEE Space Component Sovereignty for Europe programme will see Frontgrade Gaisler working with Belgian...

Published on: December 16, 2024

European chiplet pilot line starts operations

European chiplet pilot line starts operations

A pilot line for advanced packaging and heterogeneous integration, funded with €730 million by the European Union and multiple national funding authorities, has started operations.The line is known as APECs – for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems...

Published on: December 16, 2024

How the latest sensors analyse body fluids

How the latest sensors analyse body fluids

A new generation of wearable sensors will fundamentally change medicine. Researchers at ETH Zurich and international experts have now published an overview showing what is possible with such sensors and what questions their developers should consider to ensure their successful future use

Published on: December 16, 2024

Advantech and ADATA build AMR system to cut deployment time

Advantech and ADATA build AMR system to cut deployment time

Advantech and ADATA have joined forces in developing an autonomous mobile robot (AMR) system that leverages the NVIDIA Nova Orin reference platform.Combining the strengths of Advantech and ADATA, the AMR system allows developers to manage the upper-level AI system and lower-level wheelbase...

Published on: December 16, 2024

Diamond Foundry wins approval for Spanish wafer fab subsidy

Diamond Foundry wins approval for Spanish wafer fab subsidy

The Spanish government has received approval from the Europe Commission for a €81 million subsidy to be given to Diamond Foundry Europe, a subsidiary of Diamond Foundry Inc. (San Francisco, Calif.).Diamond Foundry has said it is planning to spend US$850 million building...

Published on: December 16, 2024

TCG computing DICE specification secures sensitive information, boosts performance

TCG computing DICE specification secures sensitive information, boosts performance

The Trusted Computing Group (TCG) has launched the DICE Protection Environment (DPE) specification that enables sensitive data and device operations to be kept safe in a more secure environment.Previously, the majority of major security measures were handled by a device’s firmware unless...

Published on: December 16, 2024

Integrated, compact CAN FD System Basis Chips for robust communications

Integrated, compact CAN FD System Basis Chips for robust communications

Microchip Technology have annpunced the ATA650x family of CAN FD System Basis Chips (SBCs) with a fully integrated high-speed CAN FD transceiver and a 5-V LDO regulator available in compact 8-, 10- and 14-pin space-saving packages.The ATA650x CAN FD SBCs offer a...

Published on: December 16, 2024

Nanorods for flexible thermoelectric generator sheets

Nanorods for flexible thermoelectric generator sheets

Researchers in the UK and Australia have developed an ultra-thin, flexible film using nanorods that could power next-generation wearable devices using body heat and can be used for thermal management for chips.The team at the University of Surrey, UK, and the Queensland...

Published on: December 16, 2024

Report: SK Hynix mulls offering advance packaging foundry service

Report: SK Hynix mulls offering advance packaging foundry service

Memory chip vendor SK Hynix is considering a move into 2.5D chip packaging as a foundry outsource operation, according to South Korea’s ETnews.The move may be partially driven by SK Hynix’s sub-ordinate role to foundry TSMC in the creation of AI accelerators...

Published on: December 16, 2024

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