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Click board for ML models for vibration analysis

Click board for ML models for vibration analysis

MikroE has launched a Click board that helps the development and training of AI models for vibration analysis for machine health monitoring..The MikroE ML Vibro Sens Click uses the FXLS8974CF 3-axis low-g accelerometer from NXP Semiconductors which has ultra-low-power operation alongside high-performance...

Published on: December 13, 2024

Segger supports ST’s AI microcontroller

Segger supports ST’s AI microcontroller

Segger is Germany has announced support for the STM32N6, STMicroelectronics first microcontroller with a neural processing unit (NPU) for AI and machine learning designs.A wide range of Segger’s industry-leading tools, such as the J-Link and J-Trace debug and trace probes, Flasher in-system programmers, SystemView real-time analysis tool, embOS real-time...

Published on: December 13, 2024

India’s Netrasemi raises funds for edge AI processors

India’s Netrasemi raises funds for edge AI processors

Netrasemi Pvt Ltd. (Thiruvananthapuram, Kerala, India) has raised 100 million rupees (about US$1.2 million) in seed round of funding to build system chips aimed at edge AI.Netrasemi was founded in 2020 by Jyothis Indirabhai, Sreejith Varma and Deepa Geetha and the funding...

Published on: December 13, 2024

Marvell partners with Micron, Samsung, SK Hynix on custom HBM

Marvell partners with Micron, Samsung, SK Hynix on custom HBM

Marvell has said it has been working with the three leading memory chip makers – Micron, Samsung and SK Hynix – on a custom-HBM that improves the performance of its XPU AI accelerator.Marvell has said that working with – Micron, Samsung and...

Published on: December 13, 2024

Qualcomm backs Swiss robotics firm Anybotics in $60m round

Qualcomm backs Swiss robotics firm Anybotics in $60m round

ANYbotics in Zurich has raised $60m for its four legged industrial inspection robots.The round was led by Qualcomm Ventures and Supernova Invest, with participation from TDK Ventures and other new investors, and brings the total raised to $130m.The company is backed by...

Published on: December 13, 2024

Eve taps Infineon for BMS chips

Eve taps Infineon for BMS chips

Eve Energy has signed a deal to use battery management systems (BMS) chips from Infineon Technologies.The memorandum of understanding (MoU) covers a complete chipset, including microcontroller units, balancing and monitoring ICs, power management ICs, drivers, MOSFETs, controller area networks and sensor products.These...

Published on: December 13, 2024

Optical interconnect startup reaches $1bn unicorn status

Optical interconnect startup reaches $1bn unicorn status

US startup Ayar Labs has raised $155m to scale its optical interconnect technology with a valuation of over $1bn.The funding for Ayar Labs, which also has a UK design centre, brings the total raised to $370m and comes from AMD, Intel and...

Published on: December 13, 2024

Tenstorrent powers first automotive RISC-V AI accelerator chiplet

Tenstorrent powers first automotive RISC-V AI accelerator chiplet

BOS Semiconductors in Korea has developed the industry’s first RISC-V AI accelerator chiplet using IP from US startup Tenstorrent.The Eagle-N chiplet was jointly developed by the two companies with the Tenstorrent Tensix NPU core, which is tailored for automotive applications such as...

Published on: December 12, 2024

First Ultra Ethernet, UALink IP

First Ultra Ethernet, UALink IP

Synopsys has launched the industry’s first Ultra Ethernet IP and UALink IP for standards-based, high-bandwidth, and low-latency HPC and AI accelerator interconnect.The IP includes controllers, PHYs, and verification IP for chips that have to handle trillions of parameters in the next generation of AI models.The...

Published on: December 12, 2024

Power management reference designs for digital cockpits

Power management reference designs for digital cockpits

Rohm has developed reference designs for digital cockpits using chip from Telechips and its power management ICs. The digital cockpit reference cockpit designs use the Dolphin3 and Dolphin5 from Telechips in Korea with the designs scheduled for mass production in 2025.Rohm and Telechips...

Published on: December 12, 2024

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