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European chiplet pilot line starts operations

European chiplet pilot line starts operations

A pilot line for advanced packaging and heterogeneous integration, funded with €730 million by the European Union and multiple national funding authorities, has started operations.The line is known as APECs – for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems...

Published on: December 16, 2024

How the latest sensors analyse body fluids

How the latest sensors analyse body fluids

A new generation of wearable sensors will fundamentally change medicine. Researchers at ETH Zurich and international experts have now published an overview showing what is possible with such sensors and what questions their developers should consider to ensure their successful future use

Published on: December 16, 2024

Advantech and ADATA build AMR system to cut deployment time

Advantech and ADATA build AMR system to cut deployment time

Advantech and ADATA have joined forces in developing an autonomous mobile robot (AMR) system that leverages the NVIDIA Nova Orin reference platform.Combining the strengths of Advantech and ADATA, the AMR system allows developers to manage the upper-level AI system and lower-level wheelbase...

Published on: December 16, 2024

Diamond Foundry wins approval for Spanish wafer fab subsidy

Diamond Foundry wins approval for Spanish wafer fab subsidy

The Spanish government has received approval from the Europe Commission for a €81 million subsidy to be given to Diamond Foundry Europe, a subsidiary of Diamond Foundry Inc. (San Francisco, Calif.).Diamond Foundry has said it is planning to spend US$850 million building...

Published on: December 16, 2024

TCG computing DICE specification secures sensitive information, boosts performance

TCG computing DICE specification secures sensitive information, boosts performance

The Trusted Computing Group (TCG) has launched the DICE Protection Environment (DPE) specification that enables sensitive data and device operations to be kept safe in a more secure environment.Previously, the majority of major security measures were handled by a device’s firmware unless...

Published on: December 16, 2024

Integrated, compact CAN FD System Basis Chips for robust communications

Integrated, compact CAN FD System Basis Chips for robust communications

Microchip Technology have annpunced the ATA650x family of CAN FD System Basis Chips (SBCs) with a fully integrated high-speed CAN FD transceiver and a 5-V LDO regulator available in compact 8-, 10- and 14-pin space-saving packages.The ATA650x CAN FD SBCs offer a...

Published on: December 16, 2024

Nanorods for flexible thermoelectric generator sheets

Nanorods for flexible thermoelectric generator sheets

Researchers in the UK and Australia have developed an ultra-thin, flexible film using nanorods that could power next-generation wearable devices using body heat and can be used for thermal management for chips.The team at the University of Surrey, UK, and the Queensland...

Published on: December 16, 2024

Report: SK Hynix mulls offering advance packaging foundry service

Report: SK Hynix mulls offering advance packaging foundry service

Memory chip vendor SK Hynix is considering a move into 2.5D chip packaging as a foundry outsource operation, according to South Korea’s ETnews.The move may be partially driven by SK Hynix’s sub-ordinate role to foundry TSMC in the creation of AI accelerators...

Published on: December 16, 2024

Offline voice processing algorithm for edge devices

Offline voice processing algorithm for edge devices

An algorithm developed by European researchers allows smaller devices such as smartphones, smart glasses or wearables to decode speech without needing substantial memory or internet access.The algorithm cuts the amount of memory required by immediately deleting the data as it is used,...

Published on: December 16, 2024

SESIP enables IoT manufacturers to conform to CRA rules

SESIP enables IoT manufacturers to conform to CRA rules

Manufacturers of connected devices and components that adopt the “Security Evaluation Standard for IoT Platforms” (SESIP) methodology from GlobalPlatform will be able to demonstrate conformance with the European Union’s new Cyber Resilience Act (CRA), which comes into force this month.The enactment of...

Published on: December 16, 2024

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