https://www.nuvation.com/

Electronic Breaking News

1200V SiC MOSFET for High Power AI Designs

1200V SiC MOSFET for High Power AI Designs

Alpha and Omega Semiconductor (AOS) has introduced a new 1200V silicon carbide (SiC) MOSFET series tailored for datacentre power supplies and electric vehicle on-board chargers. The third generation αSiC technology boasts a remarkable 30 percent enhancement in switching figure-of-merit (FOM) compared to...

Published on: May 03, 2025

Astera Labs ramps production of PCIe 6 AI interconnect

Astera Labs ramps production of PCIe 6 AI interconnect

Astera Labs is gearing up production of its PCI Express 6 (PCIe) chips to cater to a variety of AI infrastructure platforms. The company has introduced a gearbox that enables the combination of PCIe5 and 6 technologies, in addition to fabric switches,...

Published on: May 02, 2025

Kulr launches blockchain for battery supply chain monitoring

Kulr launches blockchain for battery supply chain monitoring

US power material startup Kulr Technology has developed a blockchain system for the verification of cells in the supply chain. One of the initial products that will be recorded on the blockchain will include lithium-ion batteries screened to meet NASA’s WI 37A...

Published on: May 02, 2025

Electrochemical RAM Insight for AI Computation

Electrochemical RAM Insight for AI Computation

South Korean and US researchers have made a groundbreaking discovery in the field of non-volatile memory technology. They have identified an operational mechanism within Electrochemical RAM (ECRAM) that has the potential to revolutionize in-memory computing for artificial intelligence (AI). By utilizing a...

Published on: May 02, 2025

Ultrasonic Wireless Charging for Implantable Devices

Ultrasonic Wireless Charging for Implantable Devices

Researchers in Korea have made a significant breakthrough in the field of wearable and implantable electronic devices by developing a biocompatible wireless charging system. This innovative system, created by a team led by Dr. Sunghoon Hur of the Korea Institute of Science...

Published on: May 02, 2025

Exploration platform for RISC-V CHERI designs

Exploration platform for RISC-V CHERI designs

European RISC-V core developer Codasip has introduced a new FPGA-based ‘exploration platform’ centered around its X730 core, which incorporates the CHERI (Capability Hardware Enhanced RISC Instructions) secure memory technology. Known as the Codasip Prime platform, this innovative system facilitates the advanced development...

Published on: May 02, 2025

“Clas-SiC to Build Power Fab in Europe”

“Clas-SiC to Build Power Fab in Europe”

Clas-SiC Wafer Fab in the UK has recently announced a significant deal to establish a power fab in mainland Europe. The company, known for its production of silicon carbide (SiC) devices in Scotland, has been making strides in the semiconductor industry with...

Published on: May 02, 2025

First on-die Power Delivery Network analyzer

First on-die Power Delivery Network analyzer

Movellus has made a significant breakthrough in the industry by introducing the first on-chip sensor designed for power delivery network (PDN) characterization and monitoring. This innovation is crucial for ensuring power integrity in system-on-chip (SoC) designs, especially in high-power AI chips and...

Published on: May 01, 2025

IonQ leverages quantum computing for AI advancements

IonQ leverages quantum computing for AI advancements

IonQ is making significant strides in the realm of quantum computing applied to artificial intelligence (AI) and machine learning. Their research has led to advancements in hybrid quantum-classical approaches that are enhancing large language models (LLMs) and generative AI. In two new...

Published on: May 01, 2025

UK opens first sub-5nm e-beam lithography centre outside Japan

UK opens first sub-5nm e-beam lithography centre outside Japan

The University of Southampton has recently unveiled the first e-beam lithography center outside of Japan with the capability to achieve resolutions under 5nm. This cutting-edge E-beam lithography (EBL) facility is only the second in the world to utilize a 200kV system, specifically...

Published on: May 01, 2025

Find Design Services

Get IC Prices

Get Price Offers From
Welcome New Vendors
Browse Vendor Directories
Featured Vendor

EFF’INNOV Technologies

Recent Posts
Most Popular Blog Posts
HardwareBee

Copyright 2017-2024, HardwareBee. All rights reserved.

Follow Us

Be sure to follow our LinkedIn company page where we share our latest updates LinkedIn
Partner with us Partner with us

Design and Manufacturing Services