NXP Semiconductors is to acquire US SerDes startup Aviva Links for $242.5m in cash.This is important for NXP for advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI), such as in-cabin digital cockpits for software-defined vehicles (SDVs), that need highly-asymmetric camera and display networks with...
Published on: December 17, 2024
Radar startup Bitsensing Inc. (Seoul, South Korea) has formed a partnership with NXP Semiconductors to offer radar for multiple sectors including automotive, smart cities, healthcare, robotics and others.The collaboration is intended to combine NXP radar chipsets with Bitsensing’s radar sensors and software....
Published on: December 17, 2024
NTT has shown the world’s first space division multiplexed long-distance terrestrial optical transmission with up to 455 Tbit/sThe long-distance transmission reached up to 1000 km using coupled-core used multicore fibre cable and saw the record field capacity of 455 terabits per second,...
Published on: December 17, 2024
Eastman, Ceres Holographics and Covestro have signed a deal for commercial production of holographic head up display (HUD) technology.The Memorandum of Understanding (MOU) will explore commercial production of the Holographic In-Plane Transparent Display (HIPTD) laminated solution for automotive and transportation glazing applications...
Published on: December 17, 2024
The ARM versus Qualcomm trial began Monday with opening statements as the licensor-licensee partners wrestle over Qualcomm’s use of acquired IP.Qualcomm obtained chip designs that are now key to AI-smartphone and AI-PC ambitions through the purchase of startup Nuvia Inc. for US$1.9...
Published on: December 17, 2024
Honeywell is exploring the potential separation of its Aerospace business.This comes after a profit warning and the acquisition of the Cobham Advanced Electronic Systems business (CAES) in September and a deal to supply avionics to Canadian aircraft maker Bombardier in December.This would...
Published on: December 17, 2024
Published on: December 17, 2024
X-FAB Silicon Foundries SE has launched XSICM03, its next-generation XbloX platform, advancing SiC process technology for power MOSFETs, delivering significantly reduced cell pitch, enabling increased die per wafer and improved on-state resistance without compromising reliability.XbloX is a streamlined business process and technology...
Published on: December 17, 2024
Following the recent launch of a range of cryogenic IP after the successful evaluation of test chips in both 180 nm and 22nm process nodes, sureCore has teamed with packaging experts, Sarcina, who designed a custom package specifically for use at cryogenic...
Published on: December 17, 2024
Four major 6G projects are launching in January 2025 targeting power efficiency in next generation telecoms networks.The projects include energy harvesting to power AI sensors as well as trials of energy-efficient 6G network technologies.Funded through the Smart Networks and Services Joint Undertaking...
Published on: December 17, 2024