Electronic Breaking News Archive - Page 145 of 453

Wi-Fi 6/Bluetooth modules deliver breakthrough power efficiency

An extension of the successful Series 2 platform, the SiWx917Y ultra-low power Wi-Fi® 6 and Bluetooth® Low Energy (LE) 5.4 modules from Silicon Labs are designed to help device makers streamline the complex development and certification process for Wi-Fi 6 devices.The new...

Published on: December 04, 2024

VSMC breaks ground on 300mm Singapore fab

VisionPower Semiconductor Manufacturing Company (VSMC) has started building its 300mm wafer manufacturing facility in Tampines, Singapore.VSMC is a joint venture between Vanguard International Semiconductor (VIS) NXP Semiconductors toThe fab, with a $7.8bn investment. will adopt a fully automated production model, integrating an Automated...

Published on: December 04, 2024

Micron to close fab as inventory hits

The newly returned CEO of Microchip Technology has cited a significant inventory overhang for his decision to close a fab in the US.The decision by Steve San? To close Fab 2 in Temple, Arizona, also hits proposed funding of $192m under the...

Published on: December 04, 2024

Moving prosthetics without implants using quantum sensors

A multidisciplinary consortium, QHMI in Stuttgart, Germany, is using quantum sensors to detect incredibly small and fast nerve signals required to control prosthetics non invasively.To control prosthetics, nerve signals must be detected to move the artificial limb. Currently, implanting electrodes is the...

Published on: December 04, 2024

‘Compact’ hard X-ray machine works!

What started as the desire to look better into paintings with so-called hard X-rays, with wavelengths smaller than a nanometer, now leads to an incredible achievement by a team of researchers led by Jom Luiten and Peter Mutsaers. With their compact ‘synchrotron’,...

Published on: December 04, 2024

First 1.6Tbit/s PAM4 DSP on 3nm process

Marvell Technology has launched the industry’s first 3nm 1.6 Tbit/s PAM4 interconnect platform for datacentre AI.The Ara platform uses 200 Gbit/s SERDES electrical and optical interfaces and builds on the Nova 2 DSP, a 1.6 Tbit/s PAM4 DSP built on a 5nm...