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Miniaturized leadless logic save space

Miniaturized leadless logic save space

Nexperia has introduced a new series of 64 miniature logic ICs in automotive-qualified MicroPak XSON5 leadless packaging.The AECq-100 devices are used in space constrained automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS).MicroPak XSON5...

Published on: December 05, 2024

$75m CHIPS Act cash for glass substrates

$75m CHIPS Act cash for glass substrates

The last days of the Biden administration in the US has seen an award of $75m to Absolics confirmed for manufacturing of glass substrates for AI chiplet packaging.Absolics, a subsidiary of Korean firm SKC, is building a 120,000 square-foot facility in Covington,...

Published on: December 05, 2024

Samsung, SK Hynix partner on processing-in-memory

Samsung, SK Hynix partner on processing-in-memory

Memory chip manufacturers Samsung and SK Hynix are collaborating to standardize processing-in-memory (PIM) in the form of an LP-DDR6 memory, according to Business Korea.The collaboration includes preliminary work to register the standardization of the LP-DDR6-PIM with the Joint Electron Device Engineering Council...

Published on: December 05, 2024

Wingtech’s Nexperia says it will comply with US restrictions

Wingtech’s Nexperia says it will comply with US restrictions

Power and discrete semiconductor vendor Nexperia BV (Nijmegen, The Netherlands) has responded to the news that its Chinese parent Wingtech has been placed on the US exports entity list.“Nexperia will comply with the US restrictions as these apply to its interactions with...

Published on: December 05, 2024

Intel approaches Lip-Bu Tan, Marvell’s Murphy about CEO post

Intel approaches Lip-Bu Tan, Marvell’s Murphy about CEO post

Intel has approached both former board member Lip-Bu Tan and Matt Murphy, CEO of Marvell, about taking the CEO post following the departure of Pat Gelsinger earlier this week, according to Reuters.The news agency reported that these two are among a “handful”...

Published on: December 05, 2024

Proof-of-concept NFC Digital Product Passport (NDPP) mobile reader

Proof-of-concept NFC Digital Product Passport (NDPP) mobile reader

A proof-of-concept mobile reader application for Android and iOS that can read on-product NFC Digital Product Passport (NDPP) data has been launched by the NFC Forum. It was one of a wide variety of demonstrations of DPP-enabled products at the recent Vision...

Published on: December 05, 2024

SKY Perfect JSAT innovation lab uses pioneering NTN testbed

SKY Perfect JSAT innovation lab uses pioneering NTN testbed

VIAVI Solutions and Rohde & Schwarz have announced that SKY Perfect JSAT Corporation has selected their joint NTN testbed for its recently unveiled “Universal NTN Innovation Lab”.SKY Perfect JSAT is a pioneer in satellite communications, the largest provider of multichannel pay TV...

Published on: December 05, 2024

WBBA sets out broadband roadmap for next-generation Metaverse

WBBA sets out broadband roadmap for next-generation Metaverse

In a new report, the World Broadband Association (WBBA) contends that countries must now set out investment, legislation and deployment plans to enable the migration towards all-fiber broadband networks required for the next generation of the internet and support Metaverse and XR...

Published on: December 05, 2024

Silicon Labs ships four million SoCs with Wirepas to India

Silicon Labs ships four million SoCs with Wirepas to India

Silicon Labs have announced that they have shipped four million FG23 SoCs with Wirepas for smart electricity meters as part of India’s Advanced Metering Initiative (AMI). These FG23 SoCs use RF mesh technology from Wirepas, a leader in wireless connectivity. The availability and...

Published on: December 05, 2024

New TPM specification boosts connected device firmware security

New TPM specification boosts connected device firmware security

Connected devices are better protected from cyberattacks and less likely to be compromised by errors thanks to the latest TPM specification (Version 2.0 ) from the Trusted Computing Group (TCG).Manufacturers attach a Trusted Platform Module (TPM) onto a device to help users...

Published on: December 05, 2024

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