NXP and Seco in Italy are working to combine silicon, the Seco Clea software and NXP EdgeLock 2GO security servicesThe Clea software platform will be available to all NXP silicon users and integrated with NXP’s EdgeLock 2GO service platform. The collaboration builds...
Published on: November 12, 2024
SEMIFIVE is collaborating with Synopsys to develop a cutting-edge high-performance computing (HPC) platform that integrates its CPU chiplet with a third-party I/O chiplet into a unified package.The SEMIFIVE HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost,...
Published on: November 12, 2024
Mitsubishi Electric Corporation will begin shipping samples of a silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) bare die for use in drive-motor inverters of electric vehicles (EVs), plug-in hybrid vehicles (PHEVs) and other electric vehicles (xEVs).Mitsubishi Electric’s first standard-specification SiC-MOSFET power semiconductor...
Published on: November 12, 2024
Variscite has announced the latest member of its DART Pin2Pin family, the DART-MX91 System on Module (SoM), which brings next-generation performance for IoT, smart cities, connected sensors, portable devices, and industrial applications.Starting at only $35, the DART-MX91 SoM is ideal for cost-sensitive...
Published on: November 12, 2024
LG Display, the world’s leading innovator of display technologies, announced its unveiling of the world’s first Stretchable display capable of expanding up to 50%, the highest rate of elongation in the industryStretchable displays are seen as the ultimate free-form screen technology because...
Published on: November 11, 2024
In October, sales of the world’s leading foundry jumped by 24.8 percent sequentially and 29.2 year-on-year to reach NT$314.24 billion (about US$9.70 billion).The foundry continues to enjoy a stellar year with year-to-date sales at NT$1,779.41 billion (about US$54.92 billion) up 31.5 percent...
Published on: November 11, 2024
TDK has launched its second generation of 6-axis IMU for automotive safety applications.The TDK InvenSense SmartAutomotive MEMS sensor family adds the IAM-20685HP and IAM-20689 for reliable motion data for decision-making algorithms and accurately detect vehicle dynamics in real-time. This is key for...
Published on: November 11, 2024
The Standardization Group for Embedded Technologies (SGET) has updated its OSM (Open Standard Module) Specification 1.2 to boost the connectivity of standard embedded modules.A newly updated OSM Design Guide 1.1 expands the guidance with insights on designing with the modules.OSM Specification 1.2...
Published on: November 11, 2024
Texas Instruments (TI) has launched two series of its C2000 real-time microcontrollers including a 64bit version with custom logic and one with a neural processor.The 200Mhz F29H85x series is built with three new 64-bit C29x digital signal processor cores with a context...
Published on: November 11, 2024
The US Department of Commerce has instructed Taiwan foundry TSMC to stop exporting AI processing and GPU chips to China that are made using 7nm or more advanced manufacturing process nodes, according to a Reuters report.The DoC sent an “is-informed” letter to...
Published on: November 11, 2024