The semiconductor downturn will see Infineon Technologies postpone the second phase of its ‘megafab’ in Kulim, Malaysia, and cut investment by 10%.“The cyclical weakness continues and the recovery in many of our end markets is sluggish,” said Jochen Hanebeck, CEO of Infineon....
Published on: November 12, 2024
The European Commission has received seven proposals for AI Factories which will boost AI innovation in the region.The first seven proposals for artificial intelligence (AI) Factories have been submitted under the EuroHPC Joint Undertaking (JU). They will be built around the EU’s network of European High-Performance...
Published on: November 12, 2024
STMicroelectronics has extended its range of STSPIN32 integrated motor drivers with eight devices for power tools, home appliances and industrial automation.The eight STSPIN32G0 devices contain gate drivers rated 45V, 250V and 600V, targeting applications from battery-operated appliances and power tools to industrial...
Published on: November 12, 2024
Ignion has announced a one-of-a-kind three-port Virtual Antenna® component with simultaneous triple radio covering cellular, GNSS, and Wi-Fi/BLE.The surface-mounted passive component, called OMNIA mXTEND, turns the ground plane of a printed circuit board (PCB) into a high-efficiency radiating element that can operate...
Published on: November 12, 2024
NXP and Seco in Italy are working to combine silicon, the Seco Clea software and NXP EdgeLock 2GO security servicesThe Clea software platform will be available to all NXP silicon users and integrated with NXP’s EdgeLock 2GO service platform. The collaboration builds...
Published on: November 12, 2024
SEMIFIVE is collaborating with Synopsys to develop a cutting-edge high-performance computing (HPC) platform that integrates its CPU chiplet with a third-party I/O chiplet into a unified package.The SEMIFIVE HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost,...
Published on: November 12, 2024
Mitsubishi Electric Corporation will begin shipping samples of a silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) bare die for use in drive-motor inverters of electric vehicles (EVs), plug-in hybrid vehicles (PHEVs) and other electric vehicles (xEVs).Mitsubishi Electric’s first standard-specification SiC-MOSFET power semiconductor...
Published on: November 12, 2024
Variscite has announced the latest member of its DART Pin2Pin family, the DART-MX91 System on Module (SoM), which brings next-generation performance for IoT, smart cities, connected sensors, portable devices, and industrial applications.Starting at only $35, the DART-MX91 SoM is ideal for cost-sensitive...
Published on: November 12, 2024
LG Display, the world’s leading innovator of display technologies, announced its unveiling of the world’s first Stretchable display capable of expanding up to 50%, the highest rate of elongation in the industryStretchable displays are seen as the ultimate free-form screen technology because...
Published on: November 11, 2024
In October, sales of the world’s leading foundry jumped by 24.8 percent sequentially and 29.2 year-on-year to reach NT$314.24 billion (about US$9.70 billion).The foundry continues to enjoy a stellar year with year-to-date sales at NT$1,779.41 billion (about US$54.92 billion) up 31.5 percent...
Published on: November 11, 2024