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Semiconductor in hydrogel form – Tissue-interfaced bioelectronics

Semiconductor in hydrogel form – Tissue-interfaced bioelectronics

New material from the UChicago Pritzker School of Molecular Engineering can create better brain-machine interfaces, biosensors, and pacemakers

Published on: November 08, 2024

$15m for US power packaging expansion

$15m for US power packaging expansion

Powerex in the US is doubling its power packaging plant in Youngwood, Pennsylvania, with a $15m investment.The expansion of Powerex, a subsidiary of Mitsubishi Electric of Japan, is set to be backed by a $3m from the US government under the CHIPS...

Published on: November 08, 2024

HummingBoard i.MX8M SBC for industrial IoT

HummingBoard i.MX8M SBC for industrial IoT

SolidRun in Israel has launched a carrier board for its i.MX8M system on module for industrial IoT (IIoT) applications.The HummingBoard i.MX8M IIOT single-board computer (SBC) combination supports a variety of industrial protocols, including multiple RS232, RS485, dual CAN-FD, and dual 1Gb Ethernet, for...

Published on: November 08, 2024

1200V IGBT cut losses in cabin motors

1200V IGBT cut losses in cabin motors

Rohm has developed four automotive-grade AEC-Q101 qualified 1200V IGBT devices that combine low loss characteristics with high short-circuit resistance. This makes the devices suitable for vehicle electric compressors and HV heaters as well as industrial inverters.The current lineup includes four models – RGA80TRX2HR / RGA80TRX2EHR / RGA80TSX2HR / RGA80TSX2EHR –...

Published on: November 08, 2024

Infineon, Stellantis team on power lab, devices

Infineon, Stellantis team on power lab, devices

Car maker Stellantis has signed a supply and capacity reservation agreement with Infineon Technologies for silicon power switches and silicon carbide (SiC) semiconductors as well as the Aurix microcontroller.Stellantis and Infineon are also extending their cooperation with the implementation of a Joint...

Published on: November 07, 2024

IO-Link transceiver has integrated transceiver

IO-Link transceiver has integrated transceiver

Orca Semiconductor has announced its second product an IO-Link communications transceiver for industrial applications. The part is numbered OS2000.The OS2000 can be used in either IO-Link master or device applications and features two control interface options: I2C or GPIO (general input output)....

Published on: November 07, 2024

Panasonic, ARM team to standardise software defined vehicles

Panasonic, ARM team to standardise software defined vehicles

ARM has signed a strategic deal with Panasonic Automotive Systems (PAS) to standardise an automotive architecture for Software-Defined Vehicles (SDVs).The two aim to create a software stack through the SOAFEE Scalable Open Architecture For the Embedded Edge initiative that is driving greater...

Published on: November 07, 2024

Alif sampling BLE and Matter MCU with neural co-processor

Alif sampling BLE and Matter MCU with neural co-processor

Alif Semiconductor®, which announced the Balletto™ Bluetooth MCU family in April, has released an evaluation board designated DK-B1 for its latest Balletto B1 product, the first Bluetooth® Low Energy (BLE) wireless microcontroller to feature hardware optimization for AI/ML workloads.The Balletto MCU features...

Published on: November 07, 2024

RADCOM RAN Analysis selected to enhance service quality

RADCOM RAN Analysis selected to enhance service quality

RADCOM has announced it has been selected by a North American operator to provide its leading RAN Analysis capabilities to enhance network service quality. This multi-year, low seven-figure contract aims to proactively ensure optimal user experiences across the operator’s 5G RAN network.RADCOM has...

Published on: November 07, 2024

Top articles on eeNews in October

Top articles on eeNews in October

The top articles on eeNews Europe in October mostly covered AI and the latest 2nm process technology, with a sprinkling of market data from the US and India.Vertical power management for AI chips will be shown at electronica later this month TI converts...

Published on: November 07, 2024

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