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ST motor drivers for industrial applications and home appliances

ST motor drivers for industrial applications and home appliances

STMicroelectronics has extended its range of STSPIN32 integrated motor drivers with eight devices for power tools, home appliances and industrial automation.The eight STSPIN32G0 devices contain gate drivers rated 45V, 250V and 600V, targeting applications from battery-operated appliances and power tools to industrial...

Published on: November 12, 2024

Passive component simplifies IoT antenna integration with triple radio support

Passive component simplifies IoT antenna integration with triple radio support

Ignion has announced a one-of-a-kind three-port Virtual Antenna® component with simultaneous triple radio covering cellular, GNSS, and Wi-Fi/BLE.The surface-mounted passive component, called OMNIA mXTEND, turns the ground plane of a printed circuit board (PCB) into a high-efficiency radiating element that can operate...

Published on: November 12, 2024

Seco, NXP team on embedded IoT security

Seco, NXP team on embedded IoT security

NXP and Seco in Italy are working to combine silicon, the Seco Clea software and NXP EdgeLock 2GO security servicesThe Clea software platform will be available to all NXP silicon users and integrated with NXP’s EdgeLock 2GO service platform. The collaboration builds...

Published on: November 12, 2024

SEMIFIVE and Synopsys to develop chiplet platform for multi-die designs

SEMIFIVE and Synopsys to develop chiplet platform for multi-die designs

SEMIFIVE is collaborating with Synopsys to develop a cutting-edge high-performance computing (HPC) platform that integrates its CPU chiplet with a third-party I/O chiplet into a unified package.The SEMIFIVE HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost,...

Published on: November 12, 2024

Mitsubishi Electric to ship SiC-MOSFET bare die samples for xEVs

Mitsubishi Electric to ship SiC-MOSFET bare die samples for xEVs

Mitsubishi Electric Corporation will begin shipping samples of a silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) bare die for use in drive-motor inverters of electric vehicles (EVs), plug-in hybrid vehicles (PHEVs) and other electric vehicles (xEVs).Mitsubishi Electric’s first standard-specification SiC-MOSFET power semiconductor...

Published on: November 12, 2024

SoM targets compact, cost-optimized edge devices

SoM targets compact, cost-optimized edge devices

Variscite has announced the latest member of its DART Pin2Pin family, the DART-MX91 System on Module (SoM), which brings next-generation performance for IoT, smart cities, connected sensors, portable devices, and industrial applications.Starting at only $35, the DART-MX91 SoM is ideal for cost-sensitive...

Published on: November 12, 2024

Stretchable Display that Expands by 50 Percent

Stretchable Display that Expands by 50 Percent

LG Display, the world’s leading innovator of display technologies, announced its unveiling of the world’s first Stretchable display capable of expanding up to 50%, the highest rate of elongation in the industryStretchable displays are seen as the ultimate free-form screen technology because...

Published on: November 11, 2024

TSMC sales climb again in October

TSMC sales climb again in October

In October, sales of the world’s leading foundry jumped by 24.8 percent sequentially and 29.2 year-on-year to reach NT$314.24 billion (about US$9.70 billion).The foundry continues to enjoy a stellar year with year-to-date sales at NT$1,779.41 billion (about US$54.92 billion) up 31.5 percent...

Published on: November 11, 2024

6-axis ASIL-D IMU for ADAS safety designs

6-axis ASIL-D IMU for ADAS safety designs

TDK has launched its second generation of 6-axis IMU for automotive safety applications.The TDK InvenSense SmartAutomotive MEMS sensor family adds the IAM-20685HP and IAM-20689 for reliable motion data for decision-making algorithms and accurately detect vehicle dynamics in real-time. This is key for...

Published on: November 11, 2024

SGET updates OSM module specification

SGET updates OSM module specification

The Standardization Group for Embedded Technologies (SGET) has updated its OSM (Open Standard Module) Specification 1.2 to boost the connectivity of standard embedded modules.A newly updated OSM Design Guide 1.1 expands the guidance with insights on designing with the modules.OSM Specification 1.2...

Published on: November 11, 2024

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