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Weather radiosonde can find its way back

Weather radiosonde can find its way back

A new type of radiosonde that can automatically fly back to a predetermined spotIt’s standard practice in many countries to launch radiosondes carried by weather balloons twice a day. These instruments climb for two hours towards the stratosphere, collecting data on wind...

Published on: November 12, 2024

MintNeuro raises £1m for brain implant

MintNeuro raises £1m for brain implant

MintNeuro has raised £1m (€1.2m $1.3m) venture funding for its semiconductor-based brain implant.MintNeuro uses a reconfigurable chip, described as smaller than a peppercorn, rather than graphene to make neural implants in the brain smaller, more efficient, and scalable. With over £14m in...

Published on: November 12, 2024

€10m project eyes 100 qubit diamond quantum computer

€10m project eyes 100 qubit diamond quantum computer

A €10m consortium funded by the European Commission and supported by the Quantum Flagship is using diamond and silicon carbide to build quantum computers and quantum simulators that can run at room temperatureThe SPINUS project is developing quantum simulators with more than...

Published on: November 12, 2024

Infineon delays Kulim fab expansion

Infineon delays Kulim fab expansion

The semiconductor downturn will see Infineon Technologies postpone the second phase of its ‘megafab’ in Kulim, Malaysia, and cut investment by 10%.“The cyclical weakness continues and the recovery in many of our end markets is sluggish,” said Jochen Hanebeck, CEO of Infineon....

Published on: November 12, 2024

Seven ‘AI factory’ proposals for Europe

Seven ‘AI factory’ proposals for Europe

The European Commission has received seven proposals for AI Factories which will boost AI innovation in the region.The first seven proposals for artificial intelligence (AI) Factories have been submitted under the EuroHPC Joint Undertaking (JU). They will be built around the EU’s network of European High-Performance...

Published on: November 12, 2024

ST motor drivers for industrial applications and home appliances

ST motor drivers for industrial applications and home appliances

STMicroelectronics has extended its range of STSPIN32 integrated motor drivers with eight devices for power tools, home appliances and industrial automation.The eight STSPIN32G0 devices contain gate drivers rated 45V, 250V and 600V, targeting applications from battery-operated appliances and power tools to industrial...

Published on: November 12, 2024

Passive component simplifies IoT antenna integration with triple radio support

Passive component simplifies IoT antenna integration with triple radio support

Ignion has announced a one-of-a-kind three-port Virtual Antenna® component with simultaneous triple radio covering cellular, GNSS, and Wi-Fi/BLE.The surface-mounted passive component, called OMNIA mXTEND, turns the ground plane of a printed circuit board (PCB) into a high-efficiency radiating element that can operate...

Published on: November 12, 2024

Seco, NXP team on embedded IoT security

Seco, NXP team on embedded IoT security

NXP and Seco in Italy are working to combine silicon, the Seco Clea software and NXP EdgeLock 2GO security servicesThe Clea software platform will be available to all NXP silicon users and integrated with NXP’s EdgeLock 2GO service platform. The collaboration builds...

Published on: November 12, 2024

SEMIFIVE and Synopsys to develop chiplet platform for multi-die designs

SEMIFIVE and Synopsys to develop chiplet platform for multi-die designs

SEMIFIVE is collaborating with Synopsys to develop a cutting-edge high-performance computing (HPC) platform that integrates its CPU chiplet with a third-party I/O chiplet into a unified package.The SEMIFIVE HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost,...

Published on: November 12, 2024

Mitsubishi Electric to ship SiC-MOSFET bare die samples for xEVs

Mitsubishi Electric to ship SiC-MOSFET bare die samples for xEVs

Mitsubishi Electric Corporation will begin shipping samples of a silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) bare die for use in drive-motor inverters of electric vehicles (EVs), plug-in hybrid vehicles (PHEVs) and other electric vehicles (xEVs).Mitsubishi Electric’s first standard-specification SiC-MOSFET power semiconductor...

Published on: November 12, 2024

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