Cambridge GaN Devices (CGD) and Qorvo® have partnered to bring together industry-leading motor control and power efficiency technologies in the PAC5556A + ICeGaN® evaluation kit (EVK).This collaboration combines Qorvo’s high-performance BLDC/PMSM motor controller/driver and CGD’s easy-to-use ICeGaN ICs in a board that...
Published on: November 11, 2024
Built on a Bipolar-CMOS-DMOS (BCD) process on an advanced 65nm node, the onsemi Treo Platform analog and mixed-signal platform provides the foundation for a wide range of power and sensing solutions from onsemi including high-performance and low-power sensing, high-efficiency power management, and...
Published on: November 11, 2024
Yokohama National University scientists have developed a promising bubble printing method that enables high-precision patterning of liquid metal wiring for flexible electronicsThis technique offers new options for creating bendable, stretchable, and highly conductive circuits, ideal for devices such as wearable sensors and...
Published on: November 11, 2024
Researchers at ETH Zurich have now provided an important contribution for the development of clean hydrogen aircraft engines: they have tested the acoustic behaviour of hydrogen injection nozzles in the lab under conditions similar to those prevalent at cruising altitude“Hydrogen burns much...
Published on: November 11, 2024
Researchers in the US have developed an paper-based energy harvesting technology that can generate power from moisture in the air for disposable sensors.The bacteria-based ‘papertronic’ power cell developed at the Bioelectronics and Microsystems Lab at Binghamton University in New York state, use spores...
Published on: November 11, 2024
Broadband vendors are aiming to tap into the smart home market using the Matter protocol, which is seen as too fragmented.A new cloud-based device management specification from the Broadband Forum will enable broadband service providers to deploy compatible devices in the smart...
Published on: November 11, 2024
SnapMagic has released over 3500 computer-aided design (CAD) models for Harwin high reliability connectors to help engineers develop boards faster.The CAD models include schematic symbols and PCB footprints and follow industry standards as well as SnapMagic’s internal standards. All the component libraries...
Published on: November 11, 2024
Renesas Electronics has teamed up with Nidec for the industry’s first ‘8 in 1’ e-axle proof of concept (PoC). The e-axle combines eight functions with a single RH850/U2B microcontroller and power management IC (PMIC) rather than separate devices for each function to significantly...
Published on: November 11, 2024
With the help of 3D printing techniques, researchers at Lawrence Livermore National Laboratory (LLNL) are “packaging” electronics with printable elastomeric silicone foams to provide both mechanical and electrical protection of sensitive componentsElectrostatic discharge (ESD) protection is a significant concern in the chemical...
Published on: November 11, 2024
Alif Semiconductor® and Edge Impulse have announced a significant breakthrough in implementing AI vision processing on edge microcontrollers (MCUs), through the introduction of full support for the Nvidia TAO model training toolkit on the Ensemble® and Balletto™ MCU families and the Edge...
Published on: November 11, 2024