STMicroelectronics has opened a power design and industrialisation centre in Pisa in Italy.The centre in Pisa Montacchiello includes a test laboratory and was created in collaboration with the Department of Information Engineering of the University of Pisa. It aims to have about 40 people...
Published on: November 05, 2024
SiliconAuto, the silicon joint venture between Foxconn and Stellantis, has partnered with IAR for safety critical development tools.As a Functional Safety (FuSa) partner, IAR will support SiliconAuto’s automotive chip development through IAR Embedded Workbench for ARM, complemented by the C-STAT and C-RUN...
Published on: November 05, 2024
Omron Electronic Components Europe has launched a PCB-mounting, high power relay that requires up to 51% less mounting space compared to similar 480-VAC, 55-A relays.Weighing just 18g with 488mm2 footprint, the G6QG power relay can contribute towards significant space savings while delivering...
Published on: November 05, 2024
Finnish technology company Quanscient, a leader in cloud-based multiphysics simulation technology and quantum algorithms, has announced new growth funding of €5.2 million. The new funding will enable Quanscient to bring engineering simulations into the quantum era.Quanscient has built the world’s first Computer...
Published on: November 05, 2024
Deeproute in China has raised $100m to develop its ADAS driver assistance system and self driving car AI software on the latest GPU technology from Nvidia.Deeproute has been developing its AI o software on the Nvidia Orin system on chip and is...
Published on: November 05, 2024
Omron Electronic Components Europe has launched a PCB-mounting, high power relay that requires up to 51% less mounting space compared to similar 480-VAC, 55-A relays.Weighing just 18g with 488mm2 footprint, the G6QG power relay can contribute towards significant space savings while delivering...
Published on: November 05, 2024
NXP Semiconductors NV has reported sales revenue for its 3Q24 of US$3.25 billion, the mid-point of the previous quarter’s guidance, but the company forecast a decline in sales in 4Q24.Revenue was up sequentially 4 percent but down year-on-year by 5 percent. The...
Published on: November 05, 2024
Murata has unveiled the first IoT connectivity module to apply the new SGP.32 Remote SIM Provisioning (RSP) specification of integrated SIM (iSIM) technology.This novel product is built upon Murata’s innovative Type 2GD Cat.M1/NB-IoT connectivity module supporting ETSI/3GPP Release 17 standard and Giesecke+Devrient’s...
Published on: November 05, 2024
An international team of researchers has developed a way to process AI in memory for photonic systems.The team, led jointly by the University of Pittsburgh and the University of California at Santa Barbara, developed the new approach to encoding optical weights for...
Published on: November 05, 2024
AI chip developer Tenstorrent (Toronto, Canada) has been commissioned by the Japanese government to provide five-years of training in leading-edge AI for up to 200 engineers.The training program will take place over the next five years in the US and at Japan’s...
Published on: November 05, 2024