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Marvel takes PCIe to Gen 7 on 3nm

Marvel takes PCIe to Gen 7 on 3nm

Fabless communications and computing chip company Marvell Technology Inc. (Santa Clara, Calif.) has demonstrated PCIe Gen 7 connectivity using 3nm silicon.Marvell PCIe Gen 7 SerDes operates at up to 128 gigatransfers per second (GT/s) per lane doubling data transfer speeds compared with...

Published on: October 15, 2024

Embedded RISC-V core meets automotive safety/security needs

Embedded RISC-V core meets automotive safety/security needs

Codasip® has announced a high-quality, high-performance RISC-V embedded core, designated L730, that meets automotive safety and security needs enabling ISO/SAE 21434 and ISO 26262 compliance up to the ASIL D integrity level.The RISC-V core incorporates optional safety mechanisms and advanced security features,...

Published on: October 15, 2024

Nano Dimension boosts speed of 3D printers, shows new resin

Nano Dimension boosts speed of 3D printers, shows new resin

Nano Dimension Ltd., a leader in 3D printers for additive manufacturing, will introduce new technology developments spanning software and materials as part of its ever-expanding AM and Micro-AM portfolio at Formnext, Frankfurt, Germany..At the event, Nano Dimension will launch advanced new software...

Published on: October 15, 2024

Love thy Robot as Thyself

Love thy Robot as Thyself

Casio is releasing Moflin, a furry robot that can act like a dog .. or a cat .. or a robotThe Moflin is a animal like robot that can interact with the owner. I can makes nice noises an interact with the...

Published on: October 15, 2024

Oculi offers soft platforms around SPU sensors

Oculi offers soft platforms around SPU sensors

Oculi Inc. (Rochester, New York ) a fabless chip company seeking to add intelligence to image sensors at the pixel level, is offering access to two platforms – Magenta and Burgundy.Oculi was founded in 2019 and the early-access evaluation platform enables a...

Published on: October 15, 2024

Infineon combines silicon and SiC in plug and play module

Infineon combines silicon and SiC in plug and play module

Infineon Technologies has combined silicon and silicon carbide for a more cost effective power module for e-mobility.The Infineon HybridPACK Drive G2 Fusion is the first plug and play power module providing a balance between performance and cost efficiency with SiC and IGBT...

Published on: October 15, 2024

UK looks to common USB-C charger specification

UK looks to common USB-C charger specification

The UK government is inviting views on the introduction of a common charger for mobile phones and other portable electrical and electronic devices.This follows the adoption of the USB-C standard for chargers across the European Union. The ‘Common Charger Directive’ EU2022/2380 will...

Published on: October 15, 2024

Wolfspeed raises $2.5bn to continue SiC plans

Wolfspeed raises $2.5bn to continue SiC plans

Wolfspeed has raised total of $2.5bn to support production of silicon carbide in a move that it says will take it to profitability.The push to build both wafer plants and a 200mm fab has pushed Wolfspeed’s finances, and these deals will allow...

Published on: October 15, 2024

ZINWELL joins HomeGrid Forum to drive in-home connectivity

ZINWELL joins HomeGrid Forum to drive in-home connectivity

ZINWELL has joined the the HomeGrid Forum, aiming to drive high-performance connectivity to residential and commercial applications across the globe.A recognized innovator in networking technologies, ZINWELL brings a comprehensive portfolio of G.hn Access solutions for a wide range of indoor and outdoor...

Published on: October 15, 2024

Lauterbach teams for virtualised RISC-V in automotive

Lauterbach teams for virtualised RISC-V in automotive

Lauterbach and hypervisor developer Kernkonzept are working together on virtualised development environment for RISC-V systems.Kernkonzept and Lauterbach have worked on a RISC-V development and debug environment for RISC-V software with a virtualized software architectures on the QEMU emulation platform.A software architecture for...

Published on: October 15, 2024

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