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imec signs up European firms for automotive chiplet programme

imec signs up European firms for automotive chiplet programme

imec has signed up ARM, BMW, Bosch, SiliconAuto, Siemens and Valeo in Europe as well as ASE, Cadence Design Systems, Synopsys and Tenstorrent for its Automotive Chiplet Programme.A meeting in Ann Arbor, Michigan, has seen key companies sign up to the Automotive...

Published on: October 11, 2024

550W open frame power supply for power over Ethernet

550W open frame power supply for power over Ethernet

TRUMPower has released an open frame AC/DC switching power supply for power over Ethernet (PoE) .The TNP550-5412 power supply delivers 550W of continuous power with cooling conditions of 19 CFM for PoE applications. It has isolated 12V and 54.5V DC outputs along...

Published on: October 11, 2024

New type of superconductivity unlocks quantum applications

New type of superconductivity unlocks quantum applications

Researchers in Switzerland and Italy have discovered a new type of superconductivity that could open up a range of new applications.The research by quantum developer Terra Quantum was published in Physical Review B and describes a novel type III superconductivity that have...

Published on: October 11, 2024

Infineon, AWL team on wireless power

Infineon, AWL team on wireless power

Canadian startup AWL-Electricity has developed a resonant wireless power system using gallium nitride devices from Infineon Technologies.AWL-E is developing its MHz resonant capacitive wireless power system with a 200W system that has a 90% efficiency at a distance of 12cm and can...

Published on: October 11, 2024

Literal Labs Achieves 50x AI Performance Boost with ‘Tsetlin’ Approach

Literal Labs Achieves 50x AI Performance Boost with ‘Tsetlin’ Approach

Literal Labs, a cutting-edge technology company based in Newcastle-upon-Tyne, England, has made significant strides in AI performance by leveraging the power of the Tsetlin machine. The company recently conducted a study measuring AI performance on MLCommons' MLPerf Tiny Benchmark using the ToyADMOS...

Published on: October 10, 2024

Niobium Team Develops Fully Encrypted GenAI Technology

Niobium Team Develops Fully Encrypted GenAI Technology

Niobium’s Fully Homomorphic Encryption (FHE) acceleration technology is revolutionizing the field of generative AI by enhancing its security measures. This innovative technology is a result of a collaboration between US chip startup Niobium and CryptoLab in Korea, aimed at safeguarding data in...

Published on: October 10, 2024

TI Unveils New PLD Programmable Logic Range

TI Unveils New PLD Programmable Logic Range

Texas Instruments has recently unveiled a groundbreaking range of integrated programmable logic devices (PLDs) that offer engineers a new level of flexibility and efficiency in their design processes. These PLDs can be easily programmed right at the engineer’s desk, streamlining the development...

Published on: October 10, 2024

Exploring AI’s Search for Extraterrestrial Life

Exploring AI’s Search for Extraterrestrial Life

Andrew Siemion, the Bernard M. Oliver Chair for SETI at the SETI Institute, expressed excitement about the future of analyzing streaming astronomical data. Siemion highlighted the potential for groundbreaking discoveries with the evolving technology. The SETI Institute, established in 1984 and now...

Published on: October 10, 2024

Infineon Partners with AWL-Electricity to Enhance Wireless Power with GaN Technology

Infineon Partners with AWL-Electricity to Enhance Wireless Power with GaN Technology

Infineon has partnered with AWL-E to introduce the CoolGaN™ GS61008P power transistor, a groundbreaking technology that is set to transform the landscape of wireless power systems across various industries. This collaboration opens up new possibilities for addressing power challenges and enhancing efficiency...

Published on: October 10, 2024

Honeywell and Qualcomm Introduce AI-Enabled 5G for Energy Sector

Honeywell and Qualcomm Introduce AI-Enabled 5G for Energy Sector

Through a recent collaboration, Honeywell has announced its intention to integrate Qualcomm Technologies' connectivity and AI capabilities into its existing AI-powered applications, such as the Honeywell Field Process Knowledge System (PKS). This integration aims to enhance the Field PKS by providing connectivity...

Published on: October 10, 2024

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