Find ASIC Vendors

Electronic Breaking News

CGD Participates in G7 and OECD Semiconductor Events

CGD Participates in G7 and OECD Semiconductor Events

Cambridge GaN Devices (CGD) is actively engaging in two significant international events focused on enhancing the resilience of the semiconductor value chain and fostering information exchange and collaboration among governments in the semiconductor sector.On 26th September, Simon Stacey, the Chief Commercial Officer...

Published on: October 01, 2024

Advantech Unveils Scalable Edge Service Packages for IoT Applications

Advantech Unveils Scalable Edge Service Packages for IoT Applications

Edge-as-a-Service is a cutting-edge concept that involves the seamless integration of hardware, edge software, and cloud services to streamline edge orchestration. This innovative approach plays a crucial role in driving successful digital transformation by harnessing the synergy between Edge and Cloud technologies....

Published on: October 01, 2024

Introducing the 6W Wireless Power Evaluation Board

Introducing the 6W Wireless Power Evaluation Board

Eggtronic, a leading innovator in wireless power technology, has introduced a groundbreaking evaluation board that leverages a RISC-V controller to enable the rapid prototyping of efficient wireless power transfer designs for low-power applications. Known as the Eggtronic WaveEgg LP EVB, this cutting-edge...

Published on: October 01, 2024

Toppan Photomask Rebrands as Tekscend Photomask

Toppan Photomask Rebrands as Tekscend Photomask

Toppan Photomask, a subsidiary of Toppan Holdings Inc. based in Tokyo, Japan, is undergoing a significant transformation. The company has announced that all its regional subsidiaries will now be known as Tekscend, replacing the familiar Toppan branding in their company names.This move...

Published on: October 01, 2024

Qualcomm Finalizes 4G IoT Tech Deal with Sequans

Qualcomm Finalizes 4G IoT Tech Deal with Sequans

Qualcomm Technologies has successfully finalized the acquisition of the 4G IoT technology developed by Sequans in France. This strategic move is expected to enhance Qualcomm's existing portfolio of purpose-built connectivity solutions for the Internet of Things (IoT) through licensing agreements. The acquisition...

Published on: October 01, 2024

TactoTek Collaborates on Automotive 3D Molded Electronics

TactoTek Collaborates on Automotive 3D Molded Electronics

TactoTek, a leader in In-Mold Structural Electronics (IMSE) technology, has joined forces with Industrias Alegre in Spain to revolutionize 3D integrated electronics for the automotive and other high-demand industries. This collaboration aims to develop highly integrated user interfaces (HMI) that incorporate lighting,...

Published on: October 01, 2024

Segger Ozone Enhances Debugging Capabilities with Rust Support

Segger Ozone Enhances Debugging Capabilities with Rust Support

Ozone, the graphical debugger and performance analyzer developed by Segger in Germany, has recently announced its support for the Rust programming language. This new integration of Rust into Ozone's capabilities is a significant step forward for developers working with embedded applications.Ozone's Rust...

Published on: October 01, 2024

Revolutionary 20 Gbit/s USB Peripheral Controller Unveiled

Revolutionary 20 Gbit/s USB Peripheral Controller Unveiled

Infineon Technologies has made a significant breakthrough in the realm of USB technology with the development of a cutting-edge 20Gbit/s programmable USB controller, marking a milestone in the industry. The new Infineon EZ-USB FX20 programmable USB controller is specifically designed for applications...

Published on: October 01, 2024

Picocom Executives Gear Up for New Radio Startup

Picocom Executives Gear Up for New Radio Startup

RANsemi Ltd. emerged onto the semiconductor scene in November 2023, founded by serial entrepreneur Peter Claydon and his colleagues from Picocom Technology Ltd. in Bristol, England. Picocom, a 5G open RAN baseband semiconductor and software specialist, is now fully owned by Chinese...

Published on: September 30, 2024

Low-Cost Smart Objects Enabled by Flexible RISC-V Processor

Low-Cost Smart Objects Enabled by Flexible RISC-V Processor

The groundbreaking paper titled 'Bendable non-silicon RISC-V microprocessor' recently made waves in the tech world after being published in the prestigious journal Nature. This paper unveiled the innovative Flex-RV, a 32-bit microprocessor developed using cutting-edge technology on a flexible polyimide substrate. Unlike...

Published on: September 30, 2024

...

5
10
15

...

214
215
216

...

220
225
230

...