Electronic Breaking News

Literal Labs Achieves 50x AI Performance Boost with ‘Tsetlin’ Approach

Literal Labs Achieves 50x AI Performance Boost with ‘Tsetlin’ Approach

Literal Labs, a cutting-edge technology company based in Newcastle-upon-Tyne, England, has made significant strides in AI performance by leveraging the power of the Tsetlin machine. The company recently conducted a study measuring AI performance on MLCommons' MLPerf Tiny Benchmark using the ToyADMOS...

Published on: October 10, 2024

Niobium Team Develops Fully Encrypted GenAI Technology

Niobium Team Develops Fully Encrypted GenAI Technology

Niobium’s Fully Homomorphic Encryption (FHE) acceleration technology is revolutionizing the field of generative AI by enhancing its security measures. This innovative technology is a result of a collaboration between US chip startup Niobium and CryptoLab in Korea, aimed at safeguarding data in...

Published on: October 10, 2024

TI Unveils New PLD Programmable Logic Range

TI Unveils New PLD Programmable Logic Range

Texas Instruments has recently unveiled a groundbreaking range of integrated programmable logic devices (PLDs) that offer engineers a new level of flexibility and efficiency in their design processes. These PLDs can be easily programmed right at the engineer’s desk, streamlining the development...

Published on: October 10, 2024

Exploring AI’s Search for Extraterrestrial Life

Exploring AI’s Search for Extraterrestrial Life

Andrew Siemion, the Bernard M. Oliver Chair for SETI at the SETI Institute, expressed excitement about the future of analyzing streaming astronomical data. Siemion highlighted the potential for groundbreaking discoveries with the evolving technology. The SETI Institute, established in 1984 and now...

Published on: October 10, 2024

Infineon Partners with AWL-Electricity to Enhance Wireless Power with GaN Technology

Infineon Partners with AWL-Electricity to Enhance Wireless Power with GaN Technology

Infineon has partnered with AWL-E to introduce the CoolGaN™ GS61008P power transistor, a groundbreaking technology that is set to transform the landscape of wireless power systems across various industries. This collaboration opens up new possibilities for addressing power challenges and enhancing efficiency...

Published on: October 10, 2024

Honeywell and Qualcomm Introduce AI-Enabled 5G for Energy Sector

Honeywell and Qualcomm Introduce AI-Enabled 5G for Energy Sector

Through a recent collaboration, Honeywell has announced its intention to integrate Qualcomm Technologies' connectivity and AI capabilities into its existing AI-powered applications, such as the Honeywell Field Process Knowledge System (PKS). This integration aims to enhance the Field PKS by providing connectivity...

Published on: October 10, 2024

BMS Utilizes 100V Bi-Directional GaN Technology

BMS Utilizes 100V Bi-Directional GaN Technology

Chinese power chip maker Innoscience Technology has introduced a cutting-edge battery management system (BMS) design utilizing 100V bidirectional gallium nitride (GaN) technology. This innovative approach aims to enhance battery safety and efficiency, offering improved power density and thermal performance in BMS designs.By...

Published on: October 10, 2024

Iridium and Nordic Semiconductor Team Up for NTN Project

Iridium and Nordic Semiconductor Team Up for NTN Project

Iridium NTN Direct is set to revolutionize the world of IoT as the first truly global NB-IoT service. This groundbreaking initiative is a result of Iridium's Project Stardust, aligning with the recent decision by the 3rd Generation Partnership Project (3GPP) to incorporate...

Published on: October 10, 2024

Revolutionary 100V Automotive Solid State Relay Unveiled

Revolutionary 100V Automotive Solid State Relay Unveiled

Vishay Intertechnology has recently unveiled a groundbreaking product in the realm of solid state relays. The company's latest offering, the Vishay VORA1010M4, stands out as the industry's first 1 Form A solid state relay to boast AEC-Q102 qualification along with a 100...

Published on: October 10, 2024

Jacobs to Design State-of-the-Art Packaging Plant in India

Jacobs to Design State-of-the-Art Packaging Plant in India

US consultancy Jacobs has been selected to design a cutting-edge Outsourced Semiconductor Assembly and Test (OSAT) packaging plant in Sanand, Gujarat, India. The project is commissioned by CG Semi, a joint venture between CG, Renesas Electronics, and Stars Microelectronics (Thailand).The upcoming facility,...

Published on: October 10, 2024