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US to Ban Chinese-Connected Self-Driving Vehicles

US to Ban Chinese-Connected Self-Driving Vehicles

The US government is taking a significant step in the ongoing trade war by considering a ban on connected and self-driving vehicles manufactured in China. This move marks a major escalation in tensions between the two countries, with potential implications for the...

Published on: September 23, 2024

NXP Collaborates with Raaam on SRAM Replacement Solution

NXP Collaborates with Raaam on SRAM Replacement Solution

Raaam, a pioneering tech company, has introduced a groundbreaking memory technology known as Gain-Cell Random Access Memory (GCRAM). According to Raaam, GCRAM offers a remarkable 50 percent reduction in area compared to SRAM, while consuming only 10 percent of the power required...

Published on: September 23, 2024

Qualcomm in Talks with Intel for Potential Buy-Out

Qualcomm in Talks with Intel for Potential Buy-Out

If an offer follows, it could potentially mark one of the largest takeover bids in the technology industry's history. However, such a move would likely trigger anti-trust scrutiny that could drag on for several quarters and potentially derail the deal.Following the news,...

Published on: September 23, 2024

Biden and Modi Unveil Indian Wafer Fab for US Defense Supply

Biden and Modi Unveil Indian Wafer Fab for US Defense Supply

The year 2025 is set to witness the establishment of a groundbreaking semiconductor fabrication facility named Shakti, a result of a strategic collaboration between Indian defense company Bharat Electronics, Indian image sensor startup 3rdiTech, and the US Space Force. This ambitious project,...

Published on: September 23, 2024

Cutting-Edge Cooling Tech Enhances AI Optical Connectors

Cutting-Edge Cooling Tech Enhances AI Optical Connectors

Molex, a leading technology company, has introduced groundbreaking plug-and-play optical feedthrough modules featuring two-phase immersion cooling to address the critical issue of thermal management in AI data centers.The innovative Molex VaporConnect Optical Feedthrough Modules utilize a cutting-edge cassette-based design that seamlessly attaches...

Published on: September 23, 2024

Cutting-Edge 5nm DSP Powers Terabit AI Infrastructure

Cutting-Edge 5nm DSP Powers Terabit AI Infrastructure

Broadcom has introduced a cutting-edge 200Gbit/s DSP PHY designed for terabit AI data center architectures, utilizing a state-of-the-art 5nm process. The newly launched 5nm Broadcom Sian2 DSP PHY is capable of delivering 200 Gbit/s per lane (200G/lane) through PAM-4 modulation, specifically tailored...

Published on: September 23, 2024

European IoT 5G Satellites Receive €10m Funding

European IoT 5G Satellites Receive €10m Funding

Sateliot, a pioneering company based in Spain, has successfully raised €10 million in its latest funding round. This significant investment will be utilized to construct narrowband NB-IoT 5G satellites, marking a major milestone in the company's ambitious plans for the future.The primary...

Published on: September 23, 2024

Advanced Imaging: 3D Multi-Layer Stacking

Advanced Imaging: 3D Multi-Layer Stacking

3D integration has revolutionized the way multiple functions can be combined within a confined space, leading to enhanced performance while minimizing power consumption. This technology has seen significant progress in various areas such as 3D stacked memories, chiplets, and heterogeneous integration. However,...

Published on: September 23, 2024

Marvell Co-Founder and Chiplet Pioneer Sehat Sutardja Passes Away at 63

Marvell Co-Founder and Chiplet Pioneer Sehat Sutardja Passes Away at 63

Marvell, a highly successful fabless chip company, has been making waves in the industry for its innovative approach to chip manufacturing. On the other hand, Silicon Box, a foundry operation based in Singapore, is pioneering chiplet-style manufacturing and has recently announced plans...

Published on: September 23, 2024

Beam Unveiled: Rovco and Vaarst Merge for First AI Undersea Robot

Beam Unveiled: Rovco and Vaarst Merge for First AI Undersea Robot

Underwater robotic system developer Rovco, based in Bristol, has made a significant move by merging its R&D spinoff, Vaarst AI, to form a new joint company named Beam. This strategic decision, which took place in 2021, brings together the expertise of 29...

Published on: September 23, 2024

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