Altera recently revealed details about its highly anticipated Agilex 3 AI FPGA, as well as introducing 11 development kits for its Agilex 5 family. The Agilex 3 AI FPGA family is set to offer a wide range of logic elements, from 25K...
Published on: September 24, 2024
The US Department of Commerce has allocated a substantial $123 million investment to Polar Semiconductor, a company based in Bloomington, Minnesota. This funding aims to double the company's sovereign foundry capacity for power and sensor chips. In addition to the government funding,...
Published on: September 24, 2024
Renesas Electronics has recently announced the expansion of its R-Car Family of system-on-chips (SoCs) to cater to the growing demand for entry-level Advanced Driver Assistance Systems (ADAS). The new Renesas R-Car V4M series is specifically designed to provide AI processing for entry-level,...
Published on: September 24, 2024
Ceva, a leading provider of semiconductor intellectual property (IP), has announced a strategic collaboration with Edge Impulse to develop small AI frameworks for the Ceva NeuPro-Nano neural processor unit (NPU). This partnership aims to empower AI developers by enabling them to train,...
Published on: September 24, 2024
The automotive industry is witnessing a significant advancement in the field of Advanced Driver Assistance Systems (ADAS) with the introduction of Renesas' latest devices, the R-Car V4M series and the expansion of the existing R-Car V4H series. These new offerings are designed...
Published on: September 24, 2024
In the ever-evolving semiconductor industry, market dynamics continue to shift, with Nvidia emerging as a dominant force. According to Omdia, Nvidia alone contributed a staggering US$18 billion in revenue in the second quarter of 2024, showcasing its significant market presence. While Nvidia's...
Published on: September 24, 2024
Housed in a compact package, Toshiba has introduced new switches that support PCIe® 5.0, USB4® Ver.2, Thunderbolt™ 4, and DisplayPort™ 2.0. These switches are designed to connect and expand peripheral devices in various applications, including PCs, server equipment, and mobile devices. The...
Published on: September 24, 2024
The CMX90A006 power amplifier is designed to serve as a final-stage ISM (915 MHz) and SRD (868 MHz) band power amplifier in various wireless transmitter applications. This two-stage indium gallium phosphide (InGaP) device is packaged to deliver +33 dBm output power at...
Published on: September 24, 2024
Photonics-electronics convergence technology is at the forefront of revolutionizing high-speed optical communication and Optical Switching Technology, paving the way for low latency and low power consumption in AI data centers and mobile fronthaul infrastructure. SoftBank is leveraging these cutting-edge technologies, incorporating NewPhotonics...
Published on: September 24, 2024
The partnership between BICS and Cellusys is set to revolutionize the roaming services offered to BICS’ customers, particularly mobile operators. This collaboration aims to bring about improvements in quality, security, and cost-effectiveness in the realm of international roaming services. Denis Souillart, Head...
Published on: September 24, 2024