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Oxford PV Delivers First Tandem Perovskite Solar Panels

Oxford PV Delivers First Tandem Perovskite Solar Panels

Oxford PV, a leading solar technology company, has achieved a significant milestone by shipping the world's first commercial perovskite tandem solar panels. The company's inaugural shipment consists of 72 cell tandem perovskite solar panels destined for a US customer for a utility-scale...

Published on: September 08, 2024

Samsung and TSMC Collaborate on Next-Gen HBM4 DRAM

Samsung and TSMC Collaborate on Next-Gen HBM4 DRAM

Kochpatcharin recently spoke at the Semicon Taiwan 2024 Forum, where it was revealed that Samsung and TSMC have joined forces on memory technology for the first time. This collaboration marks a significant milestone in the industry, bringing together two major players to...

Published on: September 08, 2024

US$10 Billion Indian Fab Gets State Approval for Tower

US$10 Billion Indian Fab Gets State Approval for Tower

After years of setbacks and bureaucratic hurdles, Tower Semiconductor is once again making headlines with its ambitious plans to establish a wafer fab in India. The company's proposal, in collaboration with Adani Group, aims to set up a state-of-the-art manufacturing facility in...

Published on: September 08, 2024

IGBT Inventor Awarded $1M Prize

IGBT Inventor Awarded $1M Prize

The prestigious 2024 Millennium Technology Prize has been awarded to Professor Bantval Jayant Baliga of North Carolina State University for his groundbreaking invention of the Insulated Gate Bipolar Transistor (IBGT). This technology, developed in the 1980s, has played a crucial role in...

Published on: September 07, 2024

AI Chiplets Boosted by Glass Substrate Alliance

AI Chiplets Boosted by Glass Substrate Alliance

An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.The E-Core Alliance, led by E&R Engineering in Taiwan, has brought together over 15 companies to accelerate the development of large glass substrates....

Published on: September 06, 2024

Advancements in GaN Technology: 300mm Wafer Breakthrough

Advancements in GaN Technology: 300mm Wafer Breakthrough

Shin-Etsu Chemical, a leading company in Japan, has recently unveiled a groundbreaking 300mm (12in) substrate designed specifically for GaN epitaxial growth. This innovative product has already entered the market in the form of samples, marking a significant advancement in the field of...

Published on: September 06, 2024

240W Charger Evaluation Board with Single-Stage PFC

240W Charger Evaluation Board with Single-Stage PFC

Eggtronic, a company based in Italy, has recently unveiled an innovative evaluation board (EVB) tailored for smaller 240W power delivery (PD) 3.1 applications that require fast charging capabilities.The SmartEgg 240W PD 3.1 EVB charger design, developed by Eggtronic, boasts a peak efficiency...

Published on: September 06, 2024

Theion Launches Solid State Sulfur Battery Center

Theion Launches Solid State Sulfur Battery Center

German battery company theion has recently inaugurated a cutting-edge Technology Centre in Berlin, signaling the commencement of customer evaluation for its innovative sulfur battery cells. Situated in the science and technology park in Adlershof, the theion centre is dedicated to the development...

Published on: September 06, 2024

Stellantis-Foxconn Venture Utilizes Siemens Tools

Stellantis-Foxconn Venture Utilizes Siemens Tools

SiliconAuto, a joint venture of European car maker Stellantis and contract manufacturer Hon Hai Technology (Foxconn), has recently announced its adoption of the PAVE360 software from Siemens Digital Industries Software. This strategic move is aimed at reducing development time for the automotive...

Published on: September 06, 2024

Nokia and CommScope Collaborate on AI-Powered Wi-Fi and Fiber Connectivity

Nokia and CommScope Collaborate on AI-Powered Wi-Fi and Fiber Connectivity

The collaboration between RUCKUS Networks and Nokia brings forth an innovative integrated fiber and Wi-Fi solution tailored to enhance end-user connectivity experiences in various settings such as multi-dwelling units (MDUs), hospitality, large public venues (LPVs), and educational institutions. This cutting-edge offering combines...

Published on: September 06, 2024

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