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Electronic Breaking News

Tech Trends Transforming Automotive Supply Chain

Tech Trends Transforming Automotive Supply Chain

The global automotive industry is undergoing a rapid transformation with the adoption of innovative technologies, as highlighted in a recent report by GlobalData. From robotics to the integration of artificial intelligence (AI) and machine learning, these advancements are reshaping the way vehicles...

Published on: August 07, 2024

UK Factory Turns E-Waste into Gold

UK Factory Turns E-Waste into Gold

The Royal Mint in the UK has taken a significant step towards sustainable practices by opening a cutting-edge commercial factory dedicated to processing gold extracted from electronic waste (e-waste). This innovative facility is set to revolutionize the recycling industry by efficiently extracting...

Published on: August 07, 2024

Revolutionary 3D-Printer Ink Enables Recyclable Electric Circuits

Revolutionary 3D-Printer Ink Enables Recyclable Electric Circuits

A groundbreaking development in the world of 3D printing has emerged from a collaboration between US and Korean researchers. This innovative team has successfully created a 3D-printing ink that has the remarkable ability to produce structures that are easy to recycle, all...

Published on: August 07, 2024

Groq Secures $640m Funding for Inference AI Chip Development

Groq Secures $640m Funding for Inference AI Chip Development

AI inference chip developer Groq has recently secured an impressive $640 million in funding, valuing the company at $2.8 billion. This significant investment will fuel Groq's ambitious plans to deploy over 108,000 Language Processing Unit (LPU) Inference Engine chips, which are manufactured...

Published on: August 06, 2024

SK hynix Strikes Billion Dollar Deal for HBM Memory Plant

SK hynix Strikes Billion Dollar Deal for HBM Memory Plant

The US Department of Commerce and SK hynix have recently inked a billion-dollar deal aimed at establishing a cutting-edge high-bandwidth memory (HBM) advanced packaging and research and development (R&D) plant. This significant agreement includes a non-binding preliminary memorandum of terms (PMT) for...

Published on: August 06, 2024

GenAI Sparks Competition: Automating Legacy C to Rust Conversion

GenAI Sparks Competition: Automating Legacy C to Rust Conversion

US research agency DARPA has embarked on an ambitious initiative known as the Translating All C to Rust (TRACTOR) program. This program aims to automate the translation of legacy C code into the inherently safer Rust programming language using large language models...

Published on: August 06, 2024

LightSolver Seeks €12.5m for Optical Supercomputer

LightSolver Seeks €12.5m for Optical Supercomputer

Israeli startup LightSolver has recently made waves in the tech industry by securing a substantial €2.5 million grant from the European Innovation Council (EIC) Accelerator Programme. This funding is earmarked for the development of an innovative all-optical supercomputer, positioning LightSolver as a...

Published on: August 06, 2024

TI Developing DLP Display Controller for Smart Glasses

TI Developing DLP Display Controller for Smart Glasses

Texas Instruments has made a significant breakthrough in display technology by shrinking its digital light projector (DLP) controller by a whopping 90%. This advancement allows for the creation of more compact 4K UltraHD projectors and opens up possibilities for integration into smart...

Published on: August 06, 2024

Cutting-Edge MEMS Circuit Breaker for Submarines

Cutting-Edge MEMS Circuit Breaker for Submarines

Menlo Microsystems, a leading technology company based in the US, has announced plans to develop a high-power circuit breaker for defense systems utilizing its innovative MEMS technology. The company is leveraging its MEMS Ideal Switch architecture to create a circuit breaker capable...

Published on: August 06, 2024

Mass Production of LPDDR5X DRAM Packages Empowering On-Device AI

Mass Production of LPDDR5X DRAM Packages Empowering On-Device AI

Leveraging its extensive expertise in chip packaging, Samsung has unveiled a groundbreaking innovation in the form of ultra-slim LPDDR5X DRAM packages. These cutting-edge packages not only provide superior performance but also create additional space within mobile devices, enabling better airflow and thermal...

Published on: August 06, 2024

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