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Breakthrough: Record Magnetic Field Achieved in Fusion Plasma Experiment

Breakthrough: Record Magnetic Field Achieved in Fusion Plasma Experiment

Realta Fusion and researchers from the University of Wisconsin have achieved a significant milestone in fusion energy research. Operating the Wisconsin HTS Axisymmetric Mirror (WHAM) experiment, they successfully formed and maintained a plasma with a magnetic field strength of 17 Tesla. This...

Published on: July 21, 2024

Rise of Engineering GPTs

Rise of Engineering GPTs

Various industries are developing their own large language models for specific engineering applications. While AI has been used for medical systems for several years, and ChatGPT has been used for chip design, connection with Wolfram analysis and even robot control, LLMs and...

Published on: July 20, 2024

ON Semiconductor Enhances 1200V Planar SiC MOSFET Technology

ON Semiconductor Enhances 1200V Planar SiC MOSFET Technology

Onsemi has introduced a cutting-edge 1200V planar silicon carbide MOSFET, marking the beginning of a new era in power semiconductor technology. The EliteSiC M3e planar SiC MOSFET boasts impressive performance improvements, including a 30% reduction in conduction losses and up to 50%...

Published on: July 19, 2024

Cutting-Edge Acoustic Digital Twin Enhances Salzburg Festival Experience

Cutting-Edge Acoustic Digital Twin Enhances Salzburg Festival Experience

Siemens, a global leader in technology and innovation, is breaking new ground in the world of acoustics with the development of a cutting-edge digital twin. This revolutionary technology is set to transform the way we experience sound in large event spaces, starting...

Published on: July 19, 2024

US Allocates $1.6bn for Defense Chiplets

US Allocates $1.6bn for Defense Chiplets

The Texas Institute for Electronics (TIE) at The University of Texas at Austin has secured an $840 million contract from the US DARPA research agency to develop high-performance chiplets for the Department of Defense. Over the next five years, TIE will establish...

Published on: July 19, 2024

High-Power 150V N-Channel MOSFET for Efficient Supplies

High-Power 150V N-Channel MOSFET for Efficient Supplies

Toshiba Electronics Europe has introduced two new 150V N-channel MOSFETs aimed at enhancing the performance of power supply designs. These MOSFETs, known as TPH1100CQ5 and TPH1400CQ5, are built on Toshiba's cutting-edge U-MOS X-H Trench process, which offers improved reverse recovery characteristics crucial...

Published on: July 19, 2024

Efficient Small FPGA for General Purpose Applications

Efficient Small FPGA for General Purpose Applications

Lattice Semiconductor has recently unveiled two new FPGA devices, the Certus-NX-28 and Certus-NX-09, which are designed on a low power FD-SOI process and optimized for logic applications. These devices come with multiple FPGA package options, catering to different needs in terms of...

Published on: July 19, 2024

Space AI Powered by ARM SoC with GPU

Space AI Powered by ARM SoC with GPU

Vorago Technologies has made a significant breakthrough in the field of space technology with the development of a radiation-hardened ARM processor equipped with a GPU specifically designed for space AI applications. The newly introduced Vorago VA7230 is a cutting-edge system-on-chip (SoC) that...

Published on: July 19, 2024

Ansys Collaborates with Supermicro and Nvidia for AI Hardware Solution

Ansys Collaborates with Supermicro and Nvidia for AI Hardware Solution

Ansys, in partnership with Supermicro and Nvidia, has developed custom hardware solutions aimed at significantly enhancing simulation speeds. This collaboration has resulted in hardware optimized specifically for Ansys multiphysics simulations, offering the potential to increase speeds by up to 1,600 times.The Nvidia...

Published on: July 19, 2024

Infineon and Amkor Collaborate for Sustainable Supply Chain

Infineon and Amkor Collaborate for Sustainable Supply Chain

Infineon Technologies and Amkor have recently entered into a partnership aimed at actively engaging with common suppliers to promote sustainability within their supply chain.The primary objective of this collaboration is for Infineon and Amkor to work together to identify areas for improvement...

Published on: July 19, 2024

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