NEO Semiconductor has introduced a groundbreaking technology called 3D X-AI, which is set to transform the landscape of artificial intelligence (AI) chip design. Built upon NEO's award-winning 3D X-DRAM™ technology, 3D X-AI is designed to simulate artificial neural networks (ANNs) by incorporating...
Published on: July 18, 2024
LG, a renowned name in the electronics industry, made a significant move earlier this year by venturing into the smart factory market. The Production Engineering Research Institute (PRI), known for enhancing production and manufacturing competitiveness within LG Group affiliates, has now extended...
Published on: July 18, 2024
Researchers at ETH Zurich have made a groundbreaking discovery that could revolutionize the future of high-energy batteries. Lithium metal batteries, considered the next generation of energy storage technology, have the potential to store twice as much energy per unit of volume compared...
Published on: July 18, 2024
Researchers have recently unveiled a groundbreaking development in drone technology with the introduction of the CoulombFly. This innovative drone is designed to achieve self-powered hovering for extended periods, relying solely on solar energy. Unlike traditional drones, the CoulombFly features a unique design...
Published on: July 18, 2024
Nanusens, a pioneering company based in the UK, has made a significant breakthrough in the realm of 6G technology. Leveraging their innovative CMOS-based MEMS technology, Nanusens has developed a cutting-edge RF front end that incorporates nanocapacitors on a chip. This revolutionary approach...
Published on: July 18, 2024
NETA Auto, a prominent automotive company in China, has recently announced its collaboration with Wind River Linux to develop an Intelligent Control Domain Controller for software-defined vehicles. This innovative project aims to revolutionize the automotive industry by integrating cutting-edge technology into vehicle...
Published on: July 17, 2024
GlobalWafers, a leading semiconductor wafer manufacturer, is on the verge of securing $400 million in funding from the US government to establish state-of-the-art 300mm silicon and silicon on insulator (SOI) wafer plants in Texas and Missouri. This move comes as part of...
Published on: July 17, 2024
Romanian startup .lumen has recently announced the launch of a €5 million funding round, with €1 million of that amount being made available on the crowd-sourcing site SeedBlink. This funding comes on the heels of .lumen successfully raising €4 million from the...
Published on: July 17, 2024
The Synopsys ARC HS4xFS Processor IP has made history by becoming the first IP product in the industry to receive ISO/SAE 21434 cybersecurity certification. This significant achievement highlights Synopsys' commitment to meeting the stringent requirements of the new automotive standard, providing a...
Published on: July 17, 2024
AI accelerator developer Femtosense has recently introduced a groundbreaking system in package (SiP) designed specifically for consumer applications. The AI-ADAM-100 SIP is a fusion of the Femtosense Sparse Processing Unit 001 (SPU-001), a neural processing unit (NPU), and an ARM Cortex M0+...
Published on: July 17, 2024