Researchers in Japan have made a significant breakthrough in the field of stretchable electronics by developing a roll-to-roll process for mass production. The team at Yokohama National University has successfully enabled the continuous production of patterned and multilayered elastic substrates with liquid...
Published on: July 22, 2024
Aethero has recently announced a groundbreaking collaboration with Antmicro, a leading technology company specializing in open source tools, to develop cutting-edge edge AI hardware tailored for space applications. This partnership aims to revolutionize the field of space technology by leveraging open source...
Published on: July 22, 2024
Researchers in the Netherlands have made a groundbreaking advancement in the field of artificial intelligence by developing a technique that significantly reduces power consumption in AI chips through on-chip training. This innovative approach, spearheaded by experts at Eindhoven University of Technology, eliminates...
Published on: July 21, 2024
Various industries are developing their own large language models for specific engineering applications. While AI has been used for medical systems for several years, and ChatGPT has been used for chip design, connection with Wolfram analysis and even robot control, LLMs and...
Published on: July 21, 2024
Realta Fusion and researchers from the University of Wisconsin have achieved a significant milestone in fusion energy research. Operating the Wisconsin HTS Axisymmetric Mirror (WHAM) experiment, they successfully formed and maintained a plasma with a magnetic field strength of 17 Tesla. This...
Published on: July 21, 2024
Various industries are developing their own large language models for specific engineering applications. While AI has been used for medical systems for several years, and ChatGPT has been used for chip design, connection with Wolfram analysis and even robot control, LLMs and...
Published on: July 20, 2024
Onsemi has introduced a cutting-edge 1200V planar silicon carbide MOSFET, marking the beginning of a new era in power semiconductor technology. The EliteSiC M3e planar SiC MOSFET boasts impressive performance improvements, including a 30% reduction in conduction losses and up to 50%...
Published on: July 19, 2024
Siemens, a global leader in technology and innovation, is breaking new ground in the world of acoustics with the development of a cutting-edge digital twin. This revolutionary technology is set to transform the way we experience sound in large event spaces, starting...
Published on: July 19, 2024
The Texas Institute for Electronics (TIE) at The University of Texas at Austin has secured an $840 million contract from the US DARPA research agency to develop high-performance chiplets for the Department of Defense. Over the next five years, TIE will establish...
Published on: July 19, 2024
Toshiba Electronics Europe has introduced two new 150V N-channel MOSFETs aimed at enhancing the performance of power supply designs. These MOSFETs, known as TPH1100CQ5 and TPH1400CQ5, are built on Toshiba's cutting-edge U-MOS X-H Trench process, which offers improved reverse recovery characteristics crucial...
Published on: July 19, 2024