The High Bandwidth Memory 4 (HBM4) standard represents a significant advancement from its predecessor, HBM3, featuring a double channel per stack and a larger physical footprint. In a strategic move to facilitate adoption, JEDEC has ensured that a single controller can seamlessly...
Published on: July 15, 2024
Toshiba Electronic Devices & Storage has introduced two new multiplexer/demultiplexer (Mux/De-Mux) switches designed for emerging high-speed differential applications like PCIe 5.0, USB4, and USB4 Ver.2.The newly launched Toshiba TDS4A212MX and TDS4B212MX mux/demux switches are specifically targeted at PC, server equipment, and mobile...
Published on: July 15, 2024
OmniOn Power, headquartered in Plano, Texas, has introduced a new line of point-of-load (POL) modules that offer enhanced design flexibility within a standard 10 x 10 mm footprint. The company's FPLX non-isolated DC-DC converter series, ranging from 15A to 30A, is designed...
Published on: July 15, 2024
OPPO, a prominent player in the global smartphone market, has recently announced a significant agreement with Ericsson, a key player in the telecommunications industry. As part of this agreement, OPPO will be making royalty payments to Ericsson for the use of their...
Published on: July 15, 2024
Accenture, a global technology consulting firm, has been making strategic moves to enhance its silicon design and engineering capabilities. The recent acquisition of Cientra Techsolution Pvt. Ltd., a chip design and engineering services company based in Bangalore, India, marks another significant step...
Published on: July 15, 2024
Panasonic Industry is at the forefront of enabling Matter technology through its range of wireless modules, catering to the essential wireless interfaces such as BLE, Thread, and Wi-Fi required by the Matter standard on PCB. In addition, the company offers PAN-MaX, a...
Published on: July 15, 2024
The RTK Evaluation Kit offers a plethora of options for prototyping, making it a valuable tool for developers looking to explore high-precision positioning solutions. Equipped with L1 + L2 RTK GNSS capabilities and an agile processor with ample memory, this kit is...
Published on: July 15, 2024
Phoenix Contact, a leading manufacturer of electrical connection and industrial automation technology, has expanded its product offerings with the introduction of the new SPT 35/..-H high-current PCB terminal blocks. This latest addition to the company's portfolio features spring connection technology and horizontal...
Published on: July 15, 2024
Apple has made a significant move in the semiconductor industry by becoming the first customer for TSMC's 2nm chips. The production flow will involve advanced packaging techniques to create the M5 processor, designed for use in both Mac computers and AI servers....
Published on: July 15, 2024
Omron Electronic Components Europe has introduced a groundbreaking 4 pole PCB relay specifically designed for 22kW Mode 3 AC EV charging stations. The Omron G9KC PCB relay stands out in the market for offering the lowest contact resistance available, resulting in significantly...
Published on: July 15, 2024