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Electronic Breaking News

Infrared VCSEL Laser: LED-Like Performance

Infrared VCSEL Laser: LED-Like Performance

Rohm, a leading technology company, has introduced a groundbreaking infrared light source that incorporates a VCSEL (Vertical Cavity Surface Emitting Laser) element within a resin optical diffusion material. This innovative product, known as the Rohm VCSELED, is designed to revolutionize automotive Driver...

Published on: June 26, 2024

Cardboard Paper Boosts Radio Frequency Energy Harvesting

Cardboard Paper Boosts Radio Frequency Energy Harvesting

The innovative use of waste cardboard paper material for constructing a rectenna has been a subject of recent investigation. Researchers have developed a simple fabrication scheme that allows for easy dismantling of the fabricated objects. The electrical traces in these designs are...

Published on: June 26, 2024

New Large FCBGA Substrate Optimized for Data Centers

New Large FCBGA Substrate Optimized for Data Centers

FCBGA, short for Flip-Chip Ball Grid Array, is a high-density semiconductor substrate that plays a crucial role in connecting semiconductor chips and package substrates. This innovative technology not only enhances electrical connectivity but also improves thermal characteristics, making it a preferred choice...

Published on: June 26, 2024

Sound Technology Enables Precise Object Movement

Sound Technology Enables Precise Object Movement

Optical tweezers have long been used to manipulate particles by creating a light 'hotspot' to trap them, akin to a ball falling into a hole. However, according to Romain Fleury, head of the Laboratory of Wave Engineering at EPFL, this method faces...

Published on: June 26, 2024

Cadence Enhances System IP Portfolio with NoC Integration for Improved Connectivity

Cadence Enhances System IP Portfolio with NoC Integration for Improved Connectivity

As the demand for larger, more complex Systems on Chips (SoCs) and disaggregated multi-chip systems continues to rise to meet escalating compute demands, the challenge of data delivery within and between silicon components has become increasingly difficult. This challenge impacts power, performance,...

Published on: June 26, 2024

Leti Innovates with Chiplets and Automated Design Tools

Leti Innovates with Chiplets and Automated Design Tools

CEA-Leti, a leading French research group based in Grenoble, has unveiled a groundbreaking chiplet architecture tailored for the automotive industry. This innovative approach is complemented by the development of cutting-edge automated tools aimed at enhancing design exploration processes.The automotive sector's transition towards...

Published on: June 26, 2024

Samsung Plans to Begin 2nm Production at Texas Fab in 2026: Report

Samsung Plans to Begin 2nm Production at Texas Fab in 2026: Report

Recent reports suggest that Samsung is gearing up for significant advancements in its semiconductor production capabilities. The company was expected to commence production on Samsung's 4nm node by the end of 2024, as per the report detailing Samsung's plans for a third...

Published on: June 26, 2024

McLaren Urges UK Government Support for Supercar Battery Hub

McLaren Urges UK Government Support for Supercar Battery Hub

The United Kingdom has the opportunity to spearhead the electrification of supercar production, according to McLaren Automotive CEO, Michael Leiters. He emphasizes the need for attracting investments into the domestic supply-chain to achieve this goal. Leiters points out that the current UK...

Published on: June 26, 2024

Real-Time Medical AI Data Interconnect with Holoscan Deal

Real-Time Medical AI Data Interconnect with Holoscan Deal

Real-Time Innovations (RTI) has announced a collaboration with Nvidia to enhance real-time data connectivity for the Holoscan software development kit (SDK) in medical applications. This partnership aims to integrate the RTI Connext publish/subscribe real-time data interconnect with Holoscan, enabling developers to create...

Published on: June 26, 2024

VW Teams Up with Rivian to Address Software Challenges

VW Teams Up with Rivian to Address Software Challenges

Volkswagen has made a significant move in the electric vehicle market by setting up a joint venture with the innovative startup Rivian to develop software-defined vehicles (SDV). The deal, valued at $5 billion, involves VW investing $3 billion in Rivian over the...

Published on: June 26, 2024

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