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Electronic Breaking News

Enhanced Speech Recognition for Augmented Reality

Enhanced Speech Recognition for Augmented Reality

Augmented reality (AR) technology is rapidly advancing, offering a wide array of possibilities to enhance everyday experiences. At the forefront of this innovation is the potential for AR to revolutionize communication through speech recognition models. Researchers have been exploring the use of...

Published on: June 24, 2024

Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology

Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology

Baya Systems and Tenstorrent have joined forces to revolutionize the world of chiplet technology. Baya’s IP and software flow have empowered Tenstorrent and its partners to analyze, customize, and deploy its intelligent compute platform for current and future workloads. This collaboration aims...

Published on: June 24, 2024

Silicon Box Chooses Novara for Italian Chiplet Fab Site

Silicon Box Chooses Novara for Italian Chiplet Fab Site

If Novara is confirmed as the location for Silicon Box's new chiplet factory, it would be situated near a 300mm wafer plant constructed by MEMC Electronic Materials SpA, the Italian subsidiary of GlobalWafers Co. Ltd. of Taiwan, which recently received a €100...

Published on: June 24, 2024

dSPACE Teams Up with AWS for Natural Language AI Testing

dSPACE Teams Up with AWS for Natural Language AI Testing

The automotive industry is on the brink of a major breakthrough in autonomous vehicle testing thanks to the collaboration between dSPACE and the AWS Generative AI Innovation Center. This partnership has led to the development of a cutting-edge scenario generation feature that...

Published on: June 24, 2024

Chip Manufacturing Capacity Expansion to Persist

Chip Manufacturing Capacity Expansion to Persist

Leading-edge capacity, defined as being for 5nm nodes and under, is expected to grow 13 percent in 2024, chiefly driven by generative artificial intelligence (AI) for data center training, inference, and leading-edge devices. Intel, Samsung, and TSMC are poised to start production...

Published on: June 24, 2024

Revolutionary Holographic Windscreen Unveiled

Revolutionary Holographic Windscreen Unveiled

Ceres Holographics, based in Scotland, has achieved a groundbreaking milestone in the automotive industry by introducing the world's first fully integrated windscreen featuring multiple holographic optical elements (HOEs) within a single laminate.The innovative holographic windscreen, developed in collaboration with Eastman in the...

Published on: June 24, 2024

IoT Satellite Test Support Added to Antenna Measurement System

IoT Satellite Test Support Added to Antenna Measurement System

ETS-Lindgren and Anritsu have joined forces to provide enhanced test support for devices utilizing the Narrow Band NTN (NB-NTN) protocol. This collaboration aims to offer a comprehensive solution for testing and validating Narrowband NTN devices that facilitate the connection of IoT devices...

Published on: June 24, 2024

Dutch Launch Consultation on Fiber Optic Industry’s Environmental Impact

Dutch Launch Consultation on Fiber Optic Industry’s Environmental Impact

Dutch trade association NLconnect has initiated a consultation process focusing on passive and active components for fibre optic network components. This move comes as NLconnect is actively involved in drawing up Life Cycle Assessments (LCA) for active components and passive materials within...

Published on: June 24, 2024

Baya Systems Unveils Chiplet Interconnect Technology – Update

Baya Systems Unveils Chiplet Interconnect Technology – Update

Baya Systems, a company that has recently emerged from stealth mode, is making waves in the semiconductor industry with its cutting-edge interconnect tool designed for chiplet and complex system on chip (SoC) architectures. According to Nandan Nayampally, the chief commercial officer of...

Published on: June 23, 2024

Microsoft Abandons Subsea Datacenter Project

Microsoft Abandons Subsea Datacenter Project

Microsoft has announced the conclusion of its innovative underwater datacentre project in the UK. The Natick project, which took place from 2018 to 2020, aimed to test a sealed subsea datacentre off the coast of the Shetland Isles. The project yielded promising...

Published on: June 23, 2024

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