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Electronic Breaking News

Efficient 4-in-1 MEMS Sensor Enhances Indoor Air Quality

Efficient 4-in-1 MEMS Sensor Enhances Indoor Air Quality

The BME690 4-in-1 MEMS sensor is a cutting-edge technology that is transforming the way we monitor indoor air quality. This innovative sensor is designed to detect high levels of volatile organic compounds (VOC) commonly found in cleaning products, cooking fumes, and other...

Published on: June 24, 2024

Haila Teams Up with e-peas for Light-Powered Wi-Fi

Haila Teams Up with e-peas for Light-Powered Wi-Fi

The landscape of energy storage for Wi-Fi connected wireless sensors is on the brink of a significant transformation, thanks to a groundbreaking demonstration by partners in the field. The partners have unveiled a demonstration that showcases a promising path towards achieving extreme...

Published on: June 24, 2024

Ceva Enhances TinyML Optimized NPUs for AIoT Devices with New IP

Ceva Enhances TinyML Optimized NPUs for AIoT Devices with New IP

As the demand for efficient and specialized AI in IoT devices continues to rise, the market for TinyML is experiencing rapid growth. Research from ABI Research suggests that by 2030, over 40% of TinyML shipments will be powered by dedicated TinyML hardware,...

Published on: June 24, 2024

CEA-Leti Unveils €830m FAMES Pilot Line Project

CEA-Leti Unveils €830m FAMES Pilot Line Project

CEA-Leti, a leading research institute in France, has recently initiated an €830 million pilot line dedicated to advancing next-generation process technologies. Known as the FAMES Pilot Line, this ambitious project aims to develop and implement five innovative sets of technologies, ranging from...

Published on: June 24, 2024

New Low Power MCU Portfolio with Wi-Fi 6/6E and Bluetooth Integration

New Low Power MCU Portfolio with Wi-Fi 6/6E and Bluetooth Integration

The latest offering from Infineon Technologies, the flexible MCU platform, is set to revolutionize the IoT industry by accelerating customers’ time-to-market with a range of cutting-edge features. This platform comes equipped with ModusToolbox ™ software, RTOS and Linux host drivers, a fully...

Published on: June 24, 2024

Rohde & Schwarz Joins AI-RAN Alliance for 5G/6G Advancement

Rohde & Schwarz Joins AI-RAN Alliance for 5G/6G Advancement

The renowned technology company Rohde & Schwarz has reached a significant milestone on its journey towards 6G by becoming a member of the AI-RAN Alliance. This move signifies a deepening of the company's collaboration with industry leaders in the development of AI-native...

Published on: June 24, 2024

Innoscience Seeks USPTO Ruling on Infineon GaN Patent

Innoscience Seeks USPTO Ruling on Infineon GaN Patent

Infineon's US Patent No. 9,899,481 lies at the center of legal disputes initiated by Infineon against Innoscience in both the United States and Europe. Innoscience Technology Co. Ltd., based in Zhuhai, China, has raised concerns regarding the validity of the patent in...

Published on: June 24, 2024

Enhanced Speech Recognition for Augmented Reality

Enhanced Speech Recognition for Augmented Reality

Augmented reality (AR) technology is rapidly advancing, offering a wide array of possibilities to enhance everyday experiences. At the forefront of this innovation is the potential for AR to revolutionize communication through speech recognition models. Researchers have been exploring the use of...

Published on: June 24, 2024

Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology

Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology

Baya Systems and Tenstorrent have joined forces to revolutionize the world of chiplet technology. Baya’s IP and software flow have empowered Tenstorrent and its partners to analyze, customize, and deploy its intelligent compute platform for current and future workloads. This collaboration aims...

Published on: June 24, 2024

Silicon Box Chooses Novara for Italian Chiplet Fab Site

Silicon Box Chooses Novara for Italian Chiplet Fab Site

If Novara is confirmed as the location for Silicon Box's new chiplet factory, it would be situated near a 300mm wafer plant constructed by MEMC Electronic Materials SpA, the Italian subsidiary of GlobalWafers Co. Ltd. of Taiwan, which recently received a €100...

Published on: June 24, 2024

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