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Electronic Breaking News

Honda and Mitsubishi Team Up for V2G Venture to Reduce Battery Costs

Honda and Mitsubishi Team Up for V2G Venture to Reduce Battery Costs

Honda and Mitsubishi have announced a groundbreaking partnership to establish a 50/50 joint venture company named ALTNA. This new venture will focus on the management and second use of electric vehicle (EV) batteries, incorporating vehicle-to-grid (V2G) technologies. ALTNA is scheduled to commence...

Published on: June 13, 2024

Three Teams Collaborate on Quantum-Safe IoT SIM Technology

Three Teams Collaborate on Quantum-Safe IoT SIM Technology

Zariot, in a strategic partnership with Kigen and Crypto Quantique, is revolutionizing the security landscape for cellular devices in the Internet of Things (IoT). This collaboration aims to provide quantum-safe protection for IoT devices, ensuring secure communication and data integrity.The core of...

Published on: June 13, 2024

Record Accuracy Achieved by Standard CMOS Quantum Computing Device

Record Accuracy Achieved by Standard CMOS Quantum Computing Device

Diraq, a quantum computing company, has made a significant advancement in the field by confirming a remarkable 99.9% single qubit control fidelity. This achievement propels Diraq to the level of precision necessary for the development of powerful, full-scale, error-corrected quantum computing processors...

Published on: June 13, 2024

Sondrel, UK Chip Designer, Secures Major Funding

Sondrel, UK Chip Designer, Secures Major Funding

David Mitchard, Sondrel’s interim CEO, expressed his excitement about the major funding that will propel Sondrel to new heights in the world of custom chip design and supply. The funding will facilitate the company's growth and expansion, solidifying its position as a...

Published on: June 13, 2024

Revolutionary 100X Performance Boost Across All CPU Architectures

Revolutionary 100X Performance Boost Across All CPU Architectures

Flow Computing, a Helsinki-based startup, is at the forefront of revolutionizing CPU performance with its groundbreaking architecture known as the Parallel Processing Unit (PPU). This innovative technology has the potential to boost CPU performance by up to 100-fold, thanks to the integration...

Published on: June 13, 2024

Milrem Robotics Enhances UGV with StarLink Integration

Milrem Robotics Enhances UGV with StarLink Integration

Milrem Robotics and AEC Skyline have recently collaborated to integrate StarLink satellite communications technology into the THeMIS Unmanned Ground Vehicle (UGV), revolutionizing the way these robotic vehicles can be controlled over long distances.By incorporating StarLink into the THeMIS Cargo CASEVAC, the unmanned...

Published on: June 12, 2024

Intel Unveils Integrated EV Chip

Intel Unveils Integrated EV Chip

Silicon Mobility, now part of Intel, has introduced a groundbreaking hybrid controller chip that merges FPGA and CPUs to streamline functions within electric vehicles.The OLEA U310 system-on-chip (SoC) from Silicon Mobility in Sweden represents a significant advancement in technology. This innovative chip...

Published on: June 12, 2024

Flow Computing Secures €4m Funding for AI CPU Advancements

Flow Computing Secures €4m Funding for AI CPU Advancements

Flow Computing, a groundbreaking company based in Helsinki, has recently emerged from stealth mode with a significant €4 million in funding. This funding is earmarked for their innovative intellectual property that promises to revolutionize the performance of processor cores across the board.Founded...

Published on: June 12, 2024

Rockchip Module: Low-Power Solution for Embedded Designs

Rockchip Module: Low-Power Solution for Embedded Designs

Cherry Embedded Solutions, based in Austria, has recently unveiled a cutting-edge system-on-module (SoM) designed for Human-Machine Interface (HMI) applications. The Ringneck SOM-PX30-µQ7 is powered by a low-power processor from Rockchip, specifically the PX30 system on chip featuring a quad-core ARM Cortex-A35 CPU.This...

Published on: June 12, 2024

Cost-Effective Manufacturing Method for Chiplet Development

Cost-Effective Manufacturing Method for Chiplet Development

The semiconductor industry is constantly evolving, with new technologies emerging to meet the demands of higher-performance chips. One such innovation is the Shin-Etsu dual damascene method, which is revolutionizing the package substrate manufacturing process. This method utilizes high-performance processing equipment, including an...

Published on: June 12, 2024

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