https://www.nuvation.com/

Electronic Breaking News

Introducing Virtual Antenna™: Simplifying IoT Device Design with Embedded Antennas

Introducing Virtual Antenna™: Simplifying IoT Device Design with Embedded Antennas

Smart sensors, smart meters, smart tracking, smart factories, smart agriculture, and all possible smart things you can imagine need to be connected. The Internet of Things (IoT) enables connecting things with other things, necessitating a relevant player that transmits and receives data...

Published on: June 03, 2024

Europe Issues New USB-C Charger Guidelines

Europe Issues New USB-C Charger Guidelines

The European Commission has recently issued new guidance regarding its 'one-size-fits-all' Common Charger Requirements. This directive, which focuses on a single USB-C charger for various electronic equipment, was officially approved by the EU Council in October 2022. The update falls under the...

Published on: June 03, 2024

Nanopower and TDK Collaborate on Indoor IoT Detector with Solid State Battery

Nanopower and TDK Collaborate on Indoor IoT Detector with Solid State Battery

Nanopower in Sweden has joined forces with TDK to create a groundbreaking wireless indoor IoT sensor demonstrator featuring a cutting-edge solid-state battery. This collaboration marks a significant advancement in the field of IoT technology, offering innovative solutions for indoor sensor applications.The wireless...

Published on: June 03, 2024

Next-Gen Superchip Successor Unveiled by Nvidia as Rubin’s Replacement for Blackwell

Next-Gen Superchip Successor Unveiled by Nvidia as Rubin’s Replacement for Blackwell

The tech world is abuzz with excitement as the CEO of Nvidia, Jensen Huang, unveiled a groundbreaking roadmap for ARM's Adonis Neoverse V4 processor. This cutting-edge processor is set to follow a one-year release cycle, aligning with the upcoming successor to the...

Published on: June 02, 2024

UAlink Challenges Nvidia in Data Center Interconnect

UAlink Challenges Nvidia in Data Center Interconnect

The data centre industry is undergoing a significant transformation with the emergence of the Ultra Accelerator Link (UALink) Consortium, a collaborative effort by major tech giants to challenge Nvidia's NVlink GPU interconnect technology. AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise, Intel, Meta,...

Published on: June 01, 2024

Epishine Secures €6m Funding for Printable Solar Cells

Epishine Secures €6m Funding for Printable Solar Cells

Epishine, a Swedish company specializing in indoor printed solar cells, has successfully raised SEK 69 million (€6m) in a recent private placement. The funding, led by Pareto Securities, received strong support from both existing and new investors, showcasing confidence in the company's...

Published on: May 31, 2024

Renault and Geely Unveil Horse Powertrain Collaboration

Renault and Geely Unveil Horse Powertrain Collaboration

Renault Group and Geely have joined forces to establish a groundbreaking partnership in the powertrain sector. The newly formed Horse Powertrain, headquartered in London, is a 50-50 joint venture between Renault and Geely. With an ambitious goal of achieving €15 billion in...

Published on: May 31, 2024

May’s Top Ten Articles on eeNews Europe

May’s Top Ten Articles on eeNews Europe

Power fabs in Dresden and Catania have recently received approval, marking significant progress in the semiconductor industry. Meanwhile, the fate of an optoelectronics fab in the UK hangs in the balance, making it one of the top articles in May on eeNews...

Published on: May 31, 2024

Tiny Tapeout 7 Unveils Open Source Z80 Design

Tiny Tapeout 7 Unveils Open Source Z80 Design

The latest round of low-cost chip making is gearing up with an open-source Z80 core and over two hundred other projects. Tiny Tapeout 7 (TT07) is set to close at 10pm CEST tomorrow (Saturday, June 1).The scheme encompasses an implementation of an...

Published on: May 31, 2024

Three-Layer Integration Enhances CMOS Image Sensor Performance with AI Boost

Three-Layer Integration Enhances CMOS Image Sensor Performance with AI Boost

CEA-Leti, a research institute in France, has made significant strides in the field of image sensor technology by developing a groundbreaking process that combines hybrid bonding and high-density through-silicon vias (TSVs) to integrate artificial intelligence (AI) into CMOS image sensors.This innovative integration...

Published on: May 31, 2024

Find Design Services

Get IC Prices

Get Price Offers From
Welcome New Vendors
Browse Vendor Directories
Featured Vendor

HQ NextPCB

Recent Posts
Most Popular Blog Posts
HardwareBee

Copyright 2017-2024, HardwareBee. All rights reserved.

Follow Us

Be sure to follow our LinkedIn company page where we share our latest updates LinkedIn
Partner with us Partner with us

Design and Manufacturing Services