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Electronic Breaking News

Sateliot Partners with ExoLaunch for 5G IoT Satellite Deployment

Sateliot Partners with ExoLaunch for 5G IoT Satellite Deployment

European operator Sateliot is gearing up to launch four satellites in collaboration with ExoLaunch and SpaceX next month, marking a significant milestone in the company's journey towards providing commercial IoT services using cutting-edge 5G technology.Spanish operator Sateliot is set to introduce a...

Published on: June 03, 2024

Advancements in Energy Storage and Desalination Technologies

Advancements in Energy Storage and Desalination Technologies

Technologies utilizing porous electrodes have been making significant strides in various fields. One notable application is in supercapacitors, which are energy storage devices known for their quick charging times and extended lifespan. Unlike traditional laptop batteries that degrade over time, supercapacitors offer...

Published on: June 03, 2024

UL Launches Battery Enclosure Material Screening Lab in Japan

UL Launches Battery Enclosure Material Screening Lab in Japan

Battery enclosures are a crucial component in ensuring the safety of electric vehicle (EV) occupants, especially in the event of a battery fire or thermal runaway. The materials used in these enclosures play a vital role in protecting individuals and preventing potential...

Published on: June 03, 2024

DeepX Secures $80.5M Funding for AI Advancement

DeepX Secures $80.5M Funding for AI Advancement

The latest funding round for DeepX, a Korean AI semiconductor startup, has successfully raised a significant amount of capital to expedite the mass production of its first product line. The company announced that the funds will also be utilized for the development...

Published on: June 03, 2024

New Packages Enhance Power Density with 650-V MOSFETs

New Packages Enhance Power Density with 650-V MOSFETs

Infineon Technologies is enhancing its range of CoolSiC™ MOSFET discretes 650 V with the introduction of two new product families, housed in the Thin-TOLL 8×8 and TOLT packages. These innovative offerings are designed to maximize the utilization of the PCB mainboard and...

Published on: June 03, 2024

Revolutionizing Solar Power with Flexible GaAs Film

Revolutionizing Solar Power with Flexible GaAs Film

Researchers in the US have made a groundbreaking discovery in the field of materials science by developing a flexible gallium arsenide (GaAs) film that has the potential to significantly reduce the cost of various technologies, including photovoltaics, displays, wireless communication devices, and...

Published on: June 03, 2024

Introducing Virtual Antenna™: Simplifying IoT Device Design with Embedded Antennas

Introducing Virtual Antenna™: Simplifying IoT Device Design with Embedded Antennas

Smart sensors, smart meters, smart tracking, smart factories, smart agriculture, and all possible smart things you can imagine need to be connected. The Internet of Things (IoT) enables connecting things with other things, necessitating a relevant player that transmits and receives data...

Published on: June 03, 2024

Europe Issues New USB-C Charger Guidelines

Europe Issues New USB-C Charger Guidelines

The European Commission has recently issued new guidance regarding its 'one-size-fits-all' Common Charger Requirements. This directive, which focuses on a single USB-C charger for various electronic equipment, was officially approved by the EU Council in October 2022. The update falls under the...

Published on: June 03, 2024

Nanopower and TDK Collaborate on Indoor IoT Detector with Solid State Battery

Nanopower and TDK Collaborate on Indoor IoT Detector with Solid State Battery

Nanopower in Sweden has joined forces with TDK to create a groundbreaking wireless indoor IoT sensor demonstrator featuring a cutting-edge solid-state battery. This collaboration marks a significant advancement in the field of IoT technology, offering innovative solutions for indoor sensor applications.The wireless...

Published on: June 03, 2024

Next-Gen Superchip Successor Unveiled by Nvidia as Rubin’s Replacement for Blackwell

Next-Gen Superchip Successor Unveiled by Nvidia as Rubin’s Replacement for Blackwell

The tech world is abuzz with excitement as the CEO of Nvidia, Jensen Huang, unveiled a groundbreaking roadmap for ARM's Adonis Neoverse V4 processor. This cutting-edge processor is set to follow a one-year release cycle, aligning with the upcoming successor to the...

Published on: June 02, 2024

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