The WSIS+20 Forum High-Level Event in Geneva, Switzerland, kicked off with the announcement of new commitments to Partner2Connect, focusing on enhancing digital connectivity through the use of AI. The event aims to reflect on the progress made and challenges faced in the...
Published on: May 28, 2024
The wafer fab located in Newton Aycliffe, County Durham, in the north of England is currently owned by Coherent Corp., a company specializing in materials, networking, and laser technology based in Saxonburg, Pennsylvania. Recent reports have indicated that local management is considering...
Published on: May 27, 2024
The leadership team at Orca Semiconductor is comprised of industry veterans with extensive experience in the analog and mixed-signal sector. The company's CEO, Andrew Baker, brings 11 years of expertise from Maxim Integrated, which was acquired by Analog Devices Inc. in August...
Published on: May 27, 2024
Infineon Technologies is making significant strides in the field of power electronics by extending its SiC MOSFETs to voltages below 650 V for AC-DC power converters. The latest addition to their lineup is the CoolSiC MOSFET 400 V family, which is built...
Published on: May 27, 2024
The recent release of a video by the People's Liberation Army (PLA) of China showcasing a simulation of an all-out attack on Taiwan has sparked concerns and raised tensions in the region. The simulation, conducted by the Eastern Theatre Command of the...
Published on: May 27, 2024
AI inference is undergoing a transformation with a strategic alliance that aims to democratize access to high-performance AI using AMD hardware. Paul Merolla, a co-founding team member of Neuralink, is leading this revolution through his new startup, MK1. The mission is clear:...
Published on: May 27, 2024
Alpha and Omega Semiconductor (AOS) has recently unveiled a groundbreaking solution for space-constrained DC-DC applications, offering significant footprint savings. The AONG36322 XSPairFET, developed by AOS, features a unique half-bridge design that utilizes two 30V MOSFETs in an innovative configuration. In this setup,...
Published on: May 27, 2024
Recent reports have shed light on the challenges faced by Samsung's HBM chips in meeting Nvidia's stringent tests, primarily due to power consumption and heat issues. The High Bandwidth Memory (HBM) DRAM multi-die components play a crucial role in GPU technology, especially...
Published on: May 27, 2024
Wireless charging technology has taken a significant leap forward with ST’s new wireless-charging protocol, opening up a world of possibilities for innovators looking to integrate wireless charging into high-power applications with shorter charging intervals. This advancement enables a wide range of devices,...
Published on: May 27, 2024
The demand for higher power server supplies is on the rise due to the increasing energy requirements of high-level GPUs, which are projected to consume over 2 kW per chip by the end of the decade. To address these needs and cater...
Published on: May 27, 2024