https://www.vvdntech.com/

Electronic Breaking News

Tiny YIG Filter Revolutionizes 6G Technology

Tiny YIG Filter Revolutionizes 6G Technology

Wireless communications are on the brink of a significant transformation, thanks to a groundbreaking new filter developed by researchers at the University of Pennsylvania. "I hope it will enable the next generation of wireless communications," says Troy Olsson, Associate Professor in Electrical...

Published on: May 30, 2024

Microchip Enhances Wireless Portfolio for Improved Bluetooth Integration

Microchip Enhances Wireless Portfolio for Improved Bluetooth Integration

Microchip has recently expanded its Bluetooth Low Energy portfolio with the introduction of the RF-ready WBZ350 module and the PIC32CX-BZ3 SoC. These new additions provide developers with more options and flexibility when integrating Bluetooth technology into their product designs. According to Rishi...

Published on: May 30, 2024

Cutting-Edge SoC: Ultra-Low-Power MRAM for Sensors/AI

Cutting-Edge SoC: Ultra-Low-Power MRAM for Sensors/AI

The development of the Custom SoC in an advanced technology node marks a significant milestone in the collaboration between Numem and IC’ALPS. This innovative SoC showcases the Numem high-performance, low power memory subsystem integrated with a RISC V Processor and AI Accelerator...

Published on: May 30, 2024

Alice & Bob Collaborates with Riverlane on Quantum Error Correction

Alice & Bob Collaborates with Riverlane on Quantum Error Correction

Quantum computing is a rapidly evolving field with the potential to revolutionize industries through its ability to solve complex problems at speeds unimaginable with classical computers. At the heart of quantum computers are qubits, the fundamental units of quantum information. However, qubits...

Published on: May 30, 2024

Cambridge GaN Devices and ITRI Sign MoU for GaN PSU

Cambridge GaN Devices and ITRI Sign MoU for GaN PSU

The recent Memorandum of Understanding (MoU) between CGD and ITRI marks a significant milestone in the realm of power device innovation. This collaboration encompasses various aspects such as the exchange of domestic and international market insights, collaborative visits to potential clients, and...

Published on: May 30, 2024

New Partnership Unveils Ultra-Low-Power SoC for Sensors and AI

New Partnership Unveils Ultra-Low-Power SoC for Sensors and AI

The development of the Custom SoC in an advanced technology node marks a significant milestone in the collaboration between Numem and IC’ALPS. This innovative SoC showcases the Numem high-performance, low-power memory subsystem integrated with a RISC V Processor and AI Accelerator tailored...

Published on: May 30, 2024

Viasat and Azercosmos to Expand Satellite Services Across EMEA/Asia

Viasat and Azercosmos to Expand Satellite Services Across EMEA/Asia

Under the proposed satellite services arrangement, Azercosmos and Viasat are set to revolutionize connectivity for a variety of industrial applications, enabling organizations to operate more efficiently, sustainably, and safely, even in the most remote locations. This partnership will facilitate crucial functions such...

Published on: May 30, 2024

LEO’s Advanced Antenna Enhances In-Flight Connectivity

LEO’s Advanced Antenna Enhances In-Flight Connectivity

State-of-the-art technology is on the brink of revolutionizing the aviation industry with the introduction of Hughes In-Flight Connectivity LEO ESA. This cutting-edge technology promises enterprise-grade, low latency, high-speed connectivity for global commercial aviation, setting new standards for in-flight internet experiences.Reza Rasoulian, Senior...

Published on: May 30, 2024

Cutting-Edge Ion-Driven Cooling Technology

Cutting-Edge Ion-Driven Cooling Technology

Ventiva, a leading technology company, has introduced its latest innovation in thermal management systems designed to cool electronic equipment efficiently and effectively.The Ventiva ICE9, the company's newest offering, utilizes intelligent software control to regulate airflow, catering to a total design power of...

Published on: May 30, 2024

ASE Demonstrates Vertical Power in AI Data Centers

ASE Demonstrates Vertical Power in AI Data Centers

Advanced Semiconductor Engineering (ASE), a leading packaging giant, has introduced a groundbreaking system in package technology aimed at enhancing power efficiency in AI and data center applications.The innovative ASE powerSiP technology is designed to minimize signal and transmission loss while effectively managing...

Published on: May 30, 2024

Find Design Services

Get IC Prices

Get Price Offers From
Welcome New Vendors
Browse Vendor Directories
Featured Vendor

QBayLogic

Recent Posts
Most Popular Blog Posts
HardwareBee

Copyright 2017-2024, HardwareBee. All rights reserved.

Follow Us

Be sure to follow our LinkedIn company page where we share our latest updates LinkedIn
Partner with us Partner with us

Design and Manufacturing Services