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Intel Collaborates on Chinese Generative AI Cockpit Innovation

Intel Collaborates on Chinese Generative AI Cockpit Innovation

Neusoft and ThunderSoft have partnered with Intel to utilize a compute platform for intelligent cockpit designs with AI customization that can scale across generations of vehicles. This collaboration aims to develop new solutions based on Intel's AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC)...

Published on: May 21, 2024

Fraunhofer IPMS and Infineon Collaborate on Smart Power Devices for 300mm Wafers

Fraunhofer IPMS and Infineon Collaborate on Smart Power Devices for 300mm Wafers

Fraunhofer IPMS and Infineon Technologies in Dresden have joined forces to develop process modules for smart power on 300mm wafers. This collaboration has resulted in the processing of 2000 300mm wafers for smart power applications. The wafers were shuttled back and forth...

Published on: May 21, 2024

AI Speeds Up Solar-Cell Perovskite Discovery

AI Speeds Up Solar-Cell Perovskite Discovery

An EPFL research project led by Haiyuan Wang and Alfredo Pasquarello, with collaborators in Shanghai and in Louvain-La-Neuve, has made significant strides in the search for optimal perovskite materials for photovoltaic applications. This innovative method combines advanced computational techniques with machine learning,...

Published on: May 21, 2024

imec Advances Quantum Computing with 300mm Qubit Process

imec Advances Quantum Computing with 300mm Qubit Process

Belgian research and development lab imec has achieved a significant milestone in the field of quantum computing by developing a stable 300mm wafer process for creating spin qubits. These spin qubits hold the key to unlocking the potential of quantum computers, and...

Published on: May 21, 2024

Murata and Michelin Strike Gen 4 RFID License Deal

Murata and Michelin Strike Gen 4 RFID License Deal

Murata Manufacturing and Michelin have recently entered into a significant licensing agreement that will see the integration of fourth-generation Murata RFID tags into Michelin automotive tires. This collaboration aims to meet European legislation requirements and enhance tire management, sustainability, security, and traceability.With...

Published on: May 21, 2024

Hardware Gateway Enhances Industrial Edge and Cloud Applications with MQTT Integration

Hardware Gateway Enhances Industrial Edge and Cloud Applications with MQTT Integration

Softing Industrial has introduced a new maintenance-free hardware solution designed for seamless transfer of production data from PLC and CNC controllers to edge and cloud-based environments.The innovative product, known as edgeGate, streamlines access to Programmable Logic Controllers (PLC) and Computerized Numerical Controllers...

Published on: May 21, 2024

Cutting-Edge Trench Microcapacitor Enhances Chip Power Efficiency

Cutting-Edge Trench Microcapacitor Enhances Chip Power Efficiency

Researchers in the US have made a significant breakthrough by developing a microcapacitor that can be seamlessly integrated into chips as a 3D trench to provide power. The team at Lawrence Berkeley National Laboratory (Berkeley Lab) and UC Berkeley has achieved remarkable...

Published on: May 21, 2024

Opportunities Available for US Patent and Trademark Public Advisory Committees

Opportunities Available for US Patent and Trademark Public Advisory Committees

The US Patent and Trademark Office (USPTO) is actively seeking individuals to fill vacancies on its Patent Public Advisory Committee (PPAC) and Trademark Public Advisory Committee (TPAC). This move aims to bring in fresh perspectives and diverse viewpoints to enhance decision-making processes...

Published on: May 20, 2024

AI Unveils 21 New Materials for Organic Solid State Lasers

AI Unveils 21 New Materials for Organic Solid State Lasers

Researchers from six teams in five labs have made a groundbreaking advancement in material discovery by harnessing the power of artificial intelligence. By utilizing AI technology, the time required to identify new materials for solid state lasers has been drastically reduced from...

Published on: May 20, 2024

USB Dongle with FRAM Technology Offers 200 Years of Data Storage

USB Dongle with FRAM Technology Offers 200 Years of Data Storage

Machdyne, a pioneering tech company based in Germany, has recently unveiled a groundbreaking USB dongle equipped with FRAM technology, promising unparalleled long-term data storage capabilities exceeding 200 years. This innovative device, known as the Blaustahl dongle, represents a significant leap forward in...

Published on: May 20, 2024

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