https://www.nuvation.com/

Electronic Breaking News

Transphorm and Weltrend Collaborate on GaN System-in-Packages

Transphorm and Weltrend Collaborate on GaN System-in-Packages

Transphorm has partnered with Weltrend Semiconductor to develop a new series of GaN System-in-Packages (SiPs) aimed at simplifying USB PD power delivery designs. The latest additions to this lineup are the WT7162RHUG24B and WT7162RHUG24C SIPs, which combine Weltrend's high frequency multi-mode Flyback...

Published on: April 24, 2024

PICMG Collaborates on Open Process Control Technology

PICMG Collaborates on Open Process Control Technology

The PICMG hardware standards consortium has joined forces with the Open Process Automation Forum (OPAF) to create interoperable and interchangeable technology specifications for edge controllers within the process control industry.This partnership addresses a gap in edge controller hardware identified within the O-PAS...

Published on: April 24, 2024

Sure! Here is a new short title for the text you provided: “NXP Unveils S32N55 Processor for Real-Time Vehicle Control

Sure! Here is a new short title for the text you provided: “NXP Unveils S32N55 Processor for Real-Time Vehicle Control

NXP Semiconductor has unveiled the first member of the S32N family, the S32N55 processor, designed for real-time vehicle control in software-defined vehicles (SDVs). This new processor is a significant step forward in the automotive industry, offering advanced features to meet the evolving...

Published on: April 24, 2024

R&S and IPG Collaborate for Comprehensive Hardware-in-the-Loop Radar Testing

R&S and IPG Collaborate for Comprehensive Hardware-in-the-Loop Radar Testing

Rohde & Schwarz has recently announced a groundbreaking collaboration with IPG Automotive to develop an innovative automotive radar Hardware-in-the-Loop (HIL) integration test system. This partnership aims to revolutionize the way radar testing is conducted in the automotive industry.The HIL radar test system...

Published on: April 24, 2024

IoT M2M Council Releases Comprehensive IoT Security Guidelines

IoT M2M Council Releases Comprehensive IoT Security Guidelines

The Internet of Things (IoT) Security Forums have a clear objective: to create practical guidelines for deploying IoT technology across consumer and industrial markets. This initiative aims to address all fundamental aspects of an IoT deployment, including devices, networks, and cloud/application software."Our...

Published on: April 24, 2024

Innovative Ink for Flexible 3D Printing

Innovative Ink for Flexible 3D Printing

Engineers working on soft robotics or wearable devices face the ongoing challenge of keeping their creations lightweight. Heavier materials not only require more energy to move around but can also lead to discomfort, especially in the case of wearables or prostheses. Elastomers,...

Published on: April 24, 2024

Mastering Light Manipulation with Precision and Efficiency

Mastering Light Manipulation with Precision and Efficiency

Unstable optical materials (TOMs) are transforming modern optoelectronics, which are electronic devices designed to detect, generate, and control light. In the realm of integrated photonics circuits, having precise control over the optical properties of materials is essential for unlocking a wide array...

Published on: April 24, 2024

Omron Sealed Power Relays Boost Switching Current to 36A

Omron Sealed Power Relays Boost Switching Current to 36A

Omron Electronic Components Europe has recently announced the expansion of its sealed power relay range with the introduction of a new 36A model, the Omron G6QE-1A4. This latest addition complements the existing G6QE 16A and 20A devices, offering enhanced flux protection capabilities.The...

Published on: April 24, 2024

Sarawak’s CSA Deal Brings Automotive and Space Tech to UK

Sarawak’s CSA Deal Brings Automotive and Space Tech to UK

The Compound Semiconductor Applications (CSA) Catapult has recently made a significant move by signing a deal with SMD Semiconductor in Sarawak, Malaysia. This partnership aims to bring SMD Semiconductor to the UK for the development of cutting-edge automotive and space power devices....

Published on: April 24, 2024

Synopsys Collaborates with TSMC on 2nm Analog IP and Photonics

Synopsys Collaborates with TSMC on 2nm Analog IP and Photonics

Synopsys and TSMC have joined forces to develop an end-to-end electronic and silicon photonics reference flow while also working on analog IP for TSMC’s cutting-edge 2nm process technology. This collaboration aims to push the boundaries of chip design and enable the creation...

Published on: April 24, 2024

Find Design Services

Get IC Prices

Get Price Offers From
Welcome New Vendors
Browse Vendor Directories
Featured Vendor

nao.design

Recent Posts
Most Popular Blog Posts
HardwareBee

Copyright 2017-2024, HardwareBee. All rights reserved.

Follow Us

Be sure to follow our LinkedIn company page where we share our latest updates LinkedIn
Partner with us Partner with us

Design and Manufacturing Services