Electronic Breaking News

China’s Silex Unveils 300mm Wafer MEMS Fab Plan

China’s Silex Unveils 300mm Wafer MEMS Fab Plan

Chinese-owned Silex Microsystems AB, based in Järfälla, Sweden, has made a significant announcement regarding its expansion plans. The company, known as the world's largest pure-play foundry for MEMS components, is set to construct a state-of-the-art 300mm wafer fab. This new facility will...

Published on: May 02, 2024

High-Power RF Transistors: 1600-2500 W for SSPAs

High-Power RF Transistors: 1600-2500 W for SSPAs

Ampleon has recently unveiled the latest additions to its power transistor lineup with the introduction of the ART2K5TFUS and ART2K5TPU models. These new transistors are specifically designed to cater to the needs of next-generation high-power industrial, scientific, and medical (ISM) applications. By...

Published on: May 02, 2024

imec.xpand Announces €300m Second Semiconductor Fund

imec.xpand Announces €300m Second Semiconductor Fund

Imec.xpand, a venture capital fund focusing on semiconductor and nanotech startups in Europe, has successfully raised €300 million for its second fund. The fund is dedicated to investing in promising startups and supporting existing companies as they scale up.Tom Vanhoutte, co-founder and...

Published on: May 02, 2024

Wind River and Elektrobit Collaborate on Software-Defined Vehicles

Wind River and Elektrobit Collaborate on Software-Defined Vehicles

Wind River has announced a strategic collaboration with Elektrobit to develop key software for self-driving software-defined vehicles. This partnership will leverage the strengths of both companies, with Wind River's VxWorks serving as the real-time operating system alongside Elektrobit's EB corbos AdaptiveCore software...

Published on: May 01, 2024

Warwick Acoustics to Manufacture Flat Panel Speakers at Mira

Warwick Acoustics to Manufacture Flat Panel Speakers at Mira

Warwick Acoustics, a leading company in automotive flat speaker technology, is making significant strides in expanding its manufacturing capabilities. The company has established a new factory at the MIRA Technology Park (MTP), which is known as Europe’s largest automotive research and development...

Published on: May 01, 2024

Video Switch Reduces Bill of Materials for Interface Standards

Video Switch Reduces Bill of Materials for Interface Standards

Diodes, a leading semiconductor manufacturer, has recently introduced an automotive-compliant 20Gbps 1:2 video switch designed specifically for in-cabin infotainment and advanced driver assistance systems (ADAS) applications.The newly launched Diodes PI3WVR14412Q video switch boasts a space-saving design that not only reduces the bill...

Published on: May 01, 2024

Ambarella and Neusoft Collaborate on Driverless Cars

Ambarella and Neusoft Collaborate on Driverless Cars

Chinese developer Neusoft has recently made a significant move by porting its AI algorithms to Ambarella’s latest 5nm CVflow edge chips. This collaboration marks a milestone in the advancement of AI technology in the automotive industry.Neusoft’s Reach Automotive Technology division is set...

Published on: May 01, 2024

Skylo Certifies Sony’s Altair Chipset for Satellite Connectivity

Skylo Certifies Sony’s Altair Chipset for Satellite Connectivity

Skylo Technologies has officially certified the Altair ALT1250 chipset from Sony Semiconductor Israel for its satellite network. This certification is a crucial step in ensuring seamless connectivity for devices utilizing the chipset, allowing for effortless support of both cellular and native satellite...

Published on: May 01, 2024

Ultra-Thin High Performance Batteries

Ultra-Thin High Performance Batteries

In order to reduce our CO2 emissions and transition to a more sustainable future, the electrification of various aspects of our lives is crucial. This includes the need to store renewable wind and solar energy efficiently. One key component in achieving this...

Published on: May 01, 2024

New Partnership Enhances Multi-Orbit Networking with Layer 7 Visibility

New Partnership Enhances Multi-Orbit Networking with Layer 7 Visibility

High-performance networks have received a significant boost through a technology partnership that has led to the creation of the XipLink Application Classification Engine (XipACE). This innovative engine integrates ipoque’s cutting-edge DPI technology, R&S®PACE 2, into the XipLink operating system (XipOS), providing advanced...

Published on: May 01, 2024