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Gowin Expands into Automotive with 12nm FPGA Technology

Gowin Expands into Automotive with 12nm FPGA Technology

FPGA ‘startup’ Gowin Semiconductor is on the brink of receiving ISO26262 certification for its FPGAs, a significant milestone that will open up new opportunities for the company in the automotive sector. The certification, expected from TÜV Rheinland this week, represents a crucial...

Published on: April 19, 2024

Intel Fellow Updates on High-NA EUV Lithography Advancements

Intel Fellow Updates on High-NA EUV Lithography Advancements

ASML Holding NV, based in Veldhoven, The Netherlands, is currently in the process of integrating and calibrating the Twinscan EXE: 5000 scanner at Intel's R&D site D1X in Hillsboro, Oregon. Mark Phillips, Intel Fellow and director of lithography, hardware, and solutions for...

Published on: April 19, 2024

Siemens Launches €100m Industrial AI R&D Center in Germany

Siemens Launches €100m Industrial AI R&D Center in Germany

Siemens, a global leader in technology and innovation, has announced plans to centralize its research and development activities in Germany with the establishment of a new €100 million centre located north of Munich. The Siemens Technology Centre (STC) in Garching, situated alongside...

Published on: April 19, 2024

Samsung and Qualcomm Enhance 5G Downlinks with 1024 QAM

Samsung and Qualcomm Enhance 5G Downlinks with 1024 QAM

Samsung Electronics and Qualcomm Technologies have made a significant breakthrough in the realm of 5G technology by demonstrating the use of 1024 Quadrature Amplitude Modulation (QAM) in both Frequency Division Duplex (FDD) and Time Division Duplex (TDD) spectrum bands.This groundbreaking achievement marks...

Published on: April 19, 2024

Integrated MEMS Clock Offers Precision Timing

Integrated MEMS Clock Offers Precision Timing

SiTime, a leading company based in the US, has recently introduced a groundbreaking family of MEMS clock system-on-a-chip designed specifically for data centre applications. Known as the Chorus family, these clock generators are tailored for precision AI datacentre timing applications, offering a...

Published on: April 19, 2024

Sonatus Launches Software Defined Vehicle R&D Center in Ireland

Sonatus Launches Software Defined Vehicle R&D Center in Ireland

Automotive software developer Sonatus has recently established a new research and development (R&D) and engineering center in Dublin, Ireland. This move marks a significant milestone for the company as it continues to expand its global presence and enhance its capabilities in the...

Published on: April 19, 2024

D-Wave Fast Anneal Boosts Quantum Computing Performance

D-Wave Fast Anneal Boosts Quantum Computing Performance

The fast-anneal feature has been a key part of D-Wave’s research milestones, including work published in Nature Physics (2022) and Nature (2023), demonstrating the advantages of annealing quantum computing over classical algorithms for solving complex optimization problems. Now widely accessible, this feature...

Published on: April 19, 2024

Cutting-Edge Timing Chip Boasts 25fs Jitter

Cutting-Edge Timing Chip Boasts 25fs Jitter

Renesas Electronics has introduced a new family of timing chips designed for wireline infrastructure, data center, and industrial applications. The FemtoClock 3 devices are equipped with low power consumption and 25fs jitter, meeting the demands of 112Gbps SerDes rates and future 224Gbps...

Published on: April 19, 2024

Faraday Licenses First ARM Automotive Core

Faraday Licenses First ARM Automotive Core

Faraday Technology, a prominent player in the semiconductor industry based in Taiwan, has recently announced its foray into the automotive sector by incorporating the latest ARM Cortex-A720AE IP for AI-enabled vehicle ASICs. This strategic move marks Faraday's initial venture into automotive applications,...

Published on: April 18, 2024

Octavo Enhances SiP Integration with Doubled Package System

Octavo Enhances SiP Integration with Doubled Package System

Octavo, a leading packaging pioneer, is on a mission to revolutionize its systems by combining two innovative technologies to enhance integration capabilities.One of Octavo's recent developments involves the creation of two types of System-in-Package (SiP) solutions for the STM32MP2 processor, which features...

Published on: April 18, 2024

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