Electronic Breaking News

AI’s Quest: Finding the Perfect Solid Electrolyte for Li-ion Batteries

AI’s Quest: Finding the Perfect Solid Electrolyte for Li-ion Batteries

Microsoft and the US Pacific Northwest National Laboratory (PNNL) have joined forces in a multi-year project aimed at exploring material science using artificial intelligence (AI) and super-computing. As part of this collaboration, the team has made a breakthrough discovery of a promising...

Published on: January 10, 2024

CES Unveils New Energy Harvester for Small Solar Cells

CES Unveils New Energy Harvester for Small Solar Cells

E-peas, a leading technology company, has developed a groundbreaking energy harvesting integrated circuit (IC) specifically designed for hand-held remote controls and wireless keyboards equipped with small solar cells. This innovative IC allows for efficient energy conversion and utilization, ensuring optimal performance for...

Published on: January 10, 2024

Bosch Unveils Groundbreaking Achievement: World’s Smallest MEMS Accelerometers

Bosch Unveils Groundbreaking Achievement: World’s Smallest MEMS Accelerometers

Bosch Sensortec has recently announced the release of its latest innovation - the BMA530 and BMA580, which are touted as the world's smallest MEMS accelerometers. These cutting-edge sensors offer a range of features and applications, catering to the growing demand for smaller...

Published on: January 10, 2024

JEDEC Releases CAMM2: The New Standard for Memory Modules

JEDEC Releases CAMM2: The New Standard for Memory Modules

JEDEC, the standards body for the microelectronics industry, has recently published a new JESD318 Compression Attached Memory Module (CAMM2) Common Standard. This standard outlines the electrical and mechanical requirements for Compression-Attached Memory Modules.The JESD318 CAMM2 standard covers two types of modules: Double...

Published on: January 10, 2024

Memory Prices Skyrocketing: What’s Behind the Surge?

Memory Prices Skyrocketing: What’s Behind the Surge?

Q1 NAND and DRAM prices are set to rise significantly, reports TrendForce.DRAM contract prices are estimated to increase by approximately 13–18% in 1Q24 with mobile DRAM leading the surge.Manufacturers believe that sustained production cuts are necessary to maintain the supply-demand balance in...

Published on: January 10, 2024

Intel Acquires Silicon Mobility: A Strategic Move in the Tech Industry

Intel Acquires Silicon Mobility: A Strategic Move in the Tech Industry

Intel, the renowned technology company, has announced its plans to acquire Silicon Mobility, a French fabless silicon and software company specializing in System-on-Chips (SoCs) for intelligent Electric Vehicle (EV) energy management. This strategic move by Intel aligns with its sustainability goals and...

Published on: January 10, 2024

NXP Paves the Way for Software-Defined Radar Technology

NXP Paves the Way for Software-Defined Radar Technology

NXP Semiconductors has unveiled an extension to its 28nm RF CMOS radar one-chip SoC family at the Consumer Electronics Show (CES) in Las Vegas. The new SAF86xx SoC is the successor to the SAF8500 and is specifically designed for smart radar sensors.The...

Published on: January 09, 2024

Code Heroes: Unleashing the Power of Raspberry Pi, micro:bit, and Circuit Playground Express

Code Heroes: Unleashing the Power of Raspberry Pi, micro:bit, and Circuit Playground Express

Time for our first addition to the Gadget Master library in 2024. Check out Save the World with Code: 20 Fun Projects for All Ages Using Raspberry Pi, micro:bit, and Circuit Playground Express.The book is written by Lorraine Underwood, the maker and...

Published on: January 09, 2024

Si Box Secures $200m Series B Funding, Expands Chiplet Production

Si Box Secures $200m Series B Funding, Expands Chiplet Production

Silicon Box, the chiplet packager founded by Marvell founders Sehat Sutardja and Weili Dai with Dr B.J Han, has raised a $200 billion Series B and is recruiting for 24/7 production at its $2 billion, 750,000 sq ft Singapore assembly plant.Founded in...

Published on: January 09, 2024

Siemens and AWS Collaborate to Simplify GenAI Application Access

Siemens and AWS Collaborate to Simplify GenAI Application Access

Siemens and AWS are collaborating to simplify the process of building and scaling GenAI applications. They are integrating Amazon Bedrock, a service that offers a range of foundation models from leading AI companies through a single API, with Mendix, which is part...

Published on: January 09, 2024